Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging

Ying Xu; Qingyuan Wang; Congcong Luo; Sohn Hoon

doi:10.3788/LOP57.061018

Journals >Laser & Optoelectronics Progress >Volume 57 >Issue 6 >Page 061018 > Article

Laser & Optoelectronics Progress
Vol. 57, Issue 6, 061018 (2020)

Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging

Ying Xu^1、*, Qingyuan Wang¹, Congcong Luo¹, and Sohn Hoon²

Author Affiliations

¹College of Civil and Environmental Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen Key Lab of Urban & Civil Engineering Disaster Prevention & Reduction, Shenzhen, Guangdong 518055, China;

²Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34708, Republic of Korea

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DOI: 10.3788/LOP57.061018 Cite this Article Set citation alerts

Ying Xu, Qingyuan Wang, Congcong Luo, Sohn Hoon. Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging[J]. Laser & Optoelectronics Progress, 2020, 57(6): 061018 Copy Citation Text

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Ying Xu, Qingyuan Wang, Congcong Luo, Sohn Hoon. Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging[J]. Laser & Optoelectronics Progress, 2020, 57(6): 061018

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