• Photonics Research
  • Vol. 12, Issue 12, 2891 (2024)
Ruoyu Shen1,2,†, Fangchen Hu2,†, Bingzhou Hong2,4, Xin Wang1,2..., Aolong Sun1, Junwen Zhang1, Haibing Zhao1, Nan Chi1, Wei Chu2,*, Haiwen Cai2,3,5 and Weiping Huang2|Show fewer author(s)
Author Affiliations
  • 1School of Information Science and Technology, Fudan University, Shanghai 200433, China
  • 2Zhangjiang Laboratory, Shanghai 201210, China
  • 3Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China
  • 4e-mail: hongbz@zjlab.ac.cn
  • 5e-mail: hwcai@siom.ac.cn
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    DOI: 10.1364/PRJ.537354 Cite this Article Set citation alerts
    Ruoyu Shen, Fangchen Hu, Bingzhou Hong, Xin Wang, Aolong Sun, Junwen Zhang, Haibing Zhao, Nan Chi, Wei Chu, Haiwen Cai, Weiping Huang, "100 nm broadband and ultra-compact multi-dimensional multiplexed photonic integrated circuit for high-capacity optical interconnects," Photonics Res. 12, 2891 (2024) Copy Citation Text show less
    (a) Schematic of the WDM-MDM-PDM multi-dimensional multiplexed photonic integrated circuit. (b) Schematic of the proposed multi-dimensional multiplexer, which multiplexes the first two modes of TE and TM polarizations. (c) Cross section of the adopted SOI platform.
    Fig. 1. (a) Schematic of the WDM-MDM-PDM multi-dimensional multiplexed photonic integrated circuit. (b) Schematic of the proposed multi-dimensional multiplexer, which multiplexes the first two modes of TE and TM polarizations. (c) Cross section of the adopted SOI platform.
    (a) The optimization procedure of the inverse design method contains adjoint optimization, binarization, and MCM. (b) The intermediate design structures generated by TO at different optimization steps. The design variable is a continuous value within the range of 0 to 1 before binarization, indicated by the “blurry boundary.” After binarization, the design variable is either 0 or 1, referring to a “sharp boundary.” (c) The iteration curve of the multi-dimensional multiplexer optimization. (d) The process of the manufacturing calibration method (MCM). (e) The structure distortion of different aperture sizes after fabrication. Yellow annotations indicate the original design. (f) Insertion losses of fabricated multiplexer with and without MCM at 1550 nm.
    Fig. 2. (a) The optimization procedure of the inverse design method contains adjoint optimization, binarization, and MCM. (b) The intermediate design structures generated by TO at different optimization steps. The design variable is a continuous value within the range of 0 to 1 before binarization, indicated by the “blurry boundary.” After binarization, the design variable is either 0 or 1, referring to a “sharp boundary.” (c) The iteration curve of the multi-dimensional multiplexer optimization. (d) The process of the manufacturing calibration method (MCM). (e) The structure distortion of different aperture sizes after fabrication. Yellow annotations indicate the original design. (f) Insertion losses of fabricated multiplexer with and without MCM at 1550 nm.
    (a)–(d) The simulated transmission spectra of the designed multi-dimensional multiplexer with and without the MCM for (a) TM1, (b) TM0, (c) TE1, and (d) TE0 modes from 1500 nm to 1600 nm. (e) The simulated mode field distributions for four mode transmission paths at 1550 nm.
    Fig. 3. (a)–(d) The simulated transmission spectra of the designed multi-dimensional multiplexer with and without the MCM for (a) TM1, (b) TM0, (c) TE1, and (d) TE0 modes from 1500 nm to 1600 nm. (e) The simulated mode field distributions for four mode transmission paths at 1550 nm.
    (a) The optical image of the fabricated MDM circuit. (b) SEM images of the back-to-back MDM multiplexer. (c)–(f) Measured transmission of the MDM circuits.
    Fig. 4. (a) The optical image of the fabricated MDM circuit. (b) SEM images of the back-to-back MDM multiplexer. (c)–(f) Measured transmission of the MDM circuits.
    The performance comparison of the experimentally demonstrated multi-dimensional multiplexer based on varying structures on the SOI platform.
    Fig. 5. The performance comparison of the experimentally demonstrated multi-dimensional multiplexer based on varying structures on the SOI platform.
    (a) Experimental setup for 100 Gbit/s PAM4 data transmission through the multi-dimensional photonic integrated circuit. (b) Measured BER curves versus received optical power for B2B and mode transfer paths. (c) Measured S21 response of I3-O3 and I3-O4 channels with the signal modulated on I3.
    Fig. 6. (a) Experimental setup for 100 Gbit/s PAM4 data transmission through the multi-dimensional photonic integrated circuit. (b) Measured BER curves versus received optical power for B2B and mode transfer paths. (c) Measured S21 response of I3-O3 and I3-O4 channels with the signal modulated on I3.
    (a) Measured BERs of four transmitted mode channels with 4 nm wavelength spacing. (b) Measured BERs of the I3-O3 mode channel with 0.8 nm wavelength spacing. (c) 100 Gbit/s eye diagrams of reference links and four MDM channels with different wavelength carriers.
    Fig. 7. (a) Measured BERs of four transmitted mode channels with 4 nm wavelength spacing. (b) Measured BERs of the I3-O3 mode channel with 0.8 nm wavelength spacing. (c) 100 Gbit/s eye diagrams of reference links and four MDM channels with different wavelength carriers.
    PathIL at 1550 nm (dB)CT at 1550 nm (dB)Maximal CT (dB)Bandwidth (nm)
    TM1 (I1-O1)1.933.3−16.5100
    TM0 (I2-O2)1.929.4−17.9100
    TE1 (I3-O3)1.920.0−16.0100
    TE0 (I4-O4)1.321.0−16.0100
    Table 1. Properties of the Inverse-Designed Multiplexer
    StructureModesFootprint (μm)IL at 1550 nm (dB)CT (dB)Bandwidth (nm)Ref./Year
    SWG4 (TE)L=49<1.8<10.0>76[42]/2021
    SWG-DC4 (TE)L=45<0.9<16.050[44]/2022
    Y-junction4 (TE)L=50<1.29<14.460[32]/2022
    DBS4 (TE/TM)6.8×6<1.4<15.040[19]/2021
    DBS4 (TE)4.8×4.8<2.95<13.040[45]/2022
    MCM-assisted TO4 (TE/TM)6×6<2.0<16.0100Our device
    Table 2. Performance Comparison of Experimentally Demonstrated MDMs on SOI
    Ruoyu Shen, Fangchen Hu, Bingzhou Hong, Xin Wang, Aolong Sun, Junwen Zhang, Haibing Zhao, Nan Chi, Wei Chu, Haiwen Cai, Weiping Huang, "100 nm broadband and ultra-compact multi-dimensional multiplexed photonic integrated circuit for high-capacity optical interconnects," Photonics Res. 12, 2891 (2024)
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