• Laser & Optoelectronics Progress
  • Vol. 60, Issue 3, 0312020 (2023)
Mu Chen, Haoran Jin*, Keji Yang, and Bingfeng Ju
Author Affiliations
  • School of Mechanical Engineering, Zhejiang University, Hangzhou 310027, Zhejiang, China
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    DOI: 10.3788/LOP223109 Cite this Article Set citation alerts
    Mu Chen, Haoran Jin, Keji Yang, Bingfeng Ju. Wavenumber-Domain Fast Reconstruction Technique Using Ultrasonic Scanning for Transverse Wave Imaging[J]. Laser & Optoelectronics Progress, 2023, 60(3): 0312020 Copy Citation Text show less
    Sound speed and thickness model of multilayer dielectric structures
    Fig. 1. Sound speed and thickness model of multilayer dielectric structures
    Principle of exploding reflecting model (ERM). (a) Equivalent route path for ERM; (b) scenes of multi-points exciting waves together, amplitude proportional reflection coefficient, and sound field synthesis and all probes receiving simultaneously
    Fig. 2. Principle of exploding reflecting model (ERM). (a) Equivalent route path for ERM; (b) scenes of multi-points exciting waves together, amplitude proportional reflection coefficient, and sound field synthesis and all probes receiving simultaneously
    Coordinate transformation and wave paths for oblique incidence algorithm
    Fig. 3. Coordinate transformation and wave paths for oblique incidence algorithm
    Flow chart and relative computational complexity of proposed algorithm
    Fig. 4. Flow chart and relative computational complexity of proposed algorithm
    Comparison of imaging for longitudinal and transverse waves at same refraction angle of 45°. (a), (d), (g) Respectively represent test specimen setups for side-drilled holes (SDHs), vertical cracks (cracks), and semi-spherical flat-bottomed holes (FBHs); (b), (e), (h) respectively represent images for longitudinal wave upon SDHs, cracks, and FBHs; (c), (f), (i) respectively represent images for transverse wave upon SDHs, cracks, and FBHs
    Fig. 5. Comparison of imaging for longitudinal and transverse waves at same refraction angle of 45°. (a), (d), (g) Respectively represent test specimen setups for side-drilled holes (SDHs), vertical cracks (cracks), and semi-spherical flat-bottomed holes (FBHs); (b), (e), (h) respectively represent images for longitudinal wave upon SDHs, cracks, and FBHs; (c), (f), (i) respectively represent images for transverse wave upon SDHs, cracks, and FBHs
    Multi-angle transverse wave imaging for vertical SDHs; (a) Test specimen setup for multi-angle transverse wave vertical SDHs; vertical SDHs imaging with refraction angles of (b) 20°, (c) 30°, (d) 40°, (e) 50°, and (f) 60°, respectively
    Fig. 6. Multi-angle transverse wave imaging for vertical SDHs; (a) Test specimen setup for multi-angle transverse wave vertical SDHs; vertical SDHs imaging with refraction angles of (b) 20°, (c) 30°, (d) 40°, (e) 50°, and (f) 60°, respectively
    API rectangle imaging area for top and bottom SDHs with each transverse wave refraction angle. (a), (c), (e), (g), (f) Respectively represent imaging for top SDHs at refraction angles of 20°, 30°, 40°, 50°, and 60°; (b), (d), (f), (h), (j) respectively represent imaging for bottom SDHs at refraction angles of 20°, 30°, 40°, 50°, and 60°
    Fig. 7. API rectangle imaging area for top and bottom SDHs with each transverse wave refraction angle. (a), (c), (e), (g), (f) Respectively represent imaging for top SDHs at refraction angles of 20°, 30°, 40°, 50°, and 60°; (b), (d), (f), (h), (j) respectively represent imaging for bottom SDHs at refraction angles of 20°, 30°, 40°, 50°, and 60°
    Effect comparison of proposed method and conventional time-domain method under 40° transverse wave refraction. (a) Whole image and API images for first and fourth SDHs respectively using proposed method; (b) whole image and API images for first and fourth SDHs respectively using conventional time-domain method
    Fig. 8. Effect comparison of proposed method and conventional time-domain method under 40° transverse wave refraction. (a) Whole image and API images for first and fourth SDHs respectively using proposed method; (b) whole image and API images for first and fourth SDHs respectively using conventional time-domain method
    Equipment setup for experiment
    Fig. 9. Equipment setup for experiment
    Defects distribution for experimental specimens. (a) Test specimens contain right side oblique placed SDHs with diameter of 1 mm; (b) test specimens contain a series of 3-mm spacing FBHs with diameters of 1, 2, 3, 4, and 6 mm respectively
    Fig. 10. Defects distribution for experimental specimens. (a) Test specimens contain right side oblique placed SDHs with diameter of 1 mm; (b) test specimens contain a series of 3-mm spacing FBHs with diameters of 1, 2, 3, 4, and 6 mm respectively
    Experimental SDH imaging with refraction angles of (a) 30°, (b) 45°, and (c) 60°, respectively when refracting into aluminum block
    Fig. 11. Experimental SDH imaging with refraction angles of (a) 30°, (b) 45°, and (c) 60°, respectively when refracting into aluminum block
    Transverse wave imaging for FBHs with refraction angle of 30°
    Fig. 12. Transverse wave imaging for FBHs with refraction angle of 30°
    Incidence angle /(°)010.214.5913.317.218.920.623.427.3
    Refractive angle of longitudinal wave /(°)045First critical angle00
    Refractive angle of transverse wave /(°)0203040455060Second critical angle
    Table 1. Refractive angles of longitudinal and transverse waves at different incidence angles
    Angle /(°)API
    SDH1SDH2SDH3SDH4
    200.0430.0410.0370.035
    300.0330.0290.0270.026
    400.0320.0340.0330.032
    500.0380.0360.0340.033
    600.0410.0400.0360.028
    Table 2. API values for ultrasonic testing imaging of SDHs using transverse waves
    Longitudinal wave incidence angle /(°)9.59.5First critical:13.617.219.821.524.5Last critical:28.6
    Transverse wave refraction angle /(°)20.220.229.430404560
    Table 3. Incidence and refraction angles used for experiments
    Mu Chen, Haoran Jin, Keji Yang, Bingfeng Ju. Wavenumber-Domain Fast Reconstruction Technique Using Ultrasonic Scanning for Transverse Wave Imaging[J]. Laser & Optoelectronics Progress, 2023, 60(3): 0312020
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