Design and Analysis on Mirco Heat Pipe Cooling Solution for High Power LED Illuminator

Li Yong; Li Pengfang; Zeng Zhixing

doi:10.3788/lop47.052201

[1] The trouble in large-scale commercial application of LED lamps[J]. Solar & Renewable Energy Sources,2008,(2):45

[2] J. Petroski. Thermal challenges facing new generation light emitting diodes (LEDs) for lighting applications[C]. SPIE,2002,4776:2152222

[3] Li Bingqian. Current-illumination characteristics of novel high power LED with metal PCB[J]. Acta photonica sinica,2005,34(3):372-374

[4] Won Kyu Jeung,Sang Hyun Shin,Suk Youn Hong et al.. Silicon-based,multi-chip LED package[C]. Electronic Components and Technology Conference,2007. 722-727

[5] C. C. Hsu,S. J. Wang,C. Y. Liu. Metallic wafer and chip bonding for LED packaging[C].IEEE Proc. 5th Pacific Rim Conference on Lasers and Electro-Optics,2003,1. 26

[6] Zhang Kai,Matthew M. F. Yuen,David G. W. Xiao et al.. Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management[C]. IEEE,2008 Electronic Components and Technology Conference,2008,978-1-4244-2231

[7] J. Petroski. Understanding longitudinal fin heat sink orientation sensitivity for Light Emitting Diode (LED) lighting applications[C]. IEEE,Proc International Electronic Packaging Technical Conference and Exhibition. Maui,Hawaii,2003.111-117

[8] Lan Kim,Jong Hwa Choi,Sun Ho Jang et al.. Thermal analysis of LED array system with heat pipe[J]. Thermo-Chimica Acta,2007,455:21-25

[9] Gwojiun Sheu,Farnshiun Hwu,Shenhang Tu et al.. The heat dissipation performance of LED applied a MHP[C]. SPIE,Fifth International Conference on Solid State Lighting,Bellingham,WA,2005,5941. 594113

[10] Ma Chunlei,Bao Chao. A novel measuring method of thermal resistance for high power LED[J]. Optical Instruments,2005,27(2):13-17

[11] Dai Weifeng,Wang Jun,Li Yuesheng. Transient thermal analysis of high-power LED Package[J]. Semiconductor Opto-Electronics,2008,29(3):324-328

[12] Yuan Liulin,Liu Sheng,Chen Mingxiang et al.. Thermal analysis of high power LED array packaging with microchannel cooler[J]. Semiconductor Opto-Electronics,2006,27(6):712-716

[14] Chen Huanting,Lü Yijun,Chen Zhong et al.. Analysis of thermal spreading boards for high-power alGaInP red LEDs[J]. Acta Optica Sinica,2009,29(3):805-810

[15] Lu Xiangyou,Cheng Yuanxia,Liu Meijing et al.. Expermental investigation on heat pipe heat sink for cooling high power LED[J]. Semicond. Optoelectronics,2008,29(5):651-654

[16] Edison Company,Ultra High Power LED

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