• Opto-Electronic Engineering
  • Vol. 34, Issue 6, 53 (2007)
[in Chinese]1、2、3, [in Chinese]1, [in Chinese]2, and [in Chinese]2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • show less
    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Filling factor fast detecting method for microlens array[J]. Opto-Electronic Engineering, 2007, 34(6): 53 Copy Citation Text show less
    References

    [1] Chunlei DU,Xiaochun DONG,Qiling DENG,et al.Profile control technology for high performance microlens array[J].Opt.Eng,2004,43:2840-2844.

    [2] D.KWO,G.DAMAS,W.ZMEK.A Hartmann-Shack wavefront sensor using a binary optical lenslet array[J].SPIE,1991,1544:66-74.

    [3] M.P.RAO,M.F.AIMI,N.C.MACDONALD.Single-mask,three-dimensional microfabrication of high-aspect-ratio structures in bulk silicon using reactive ion etching lag and sacrificial oxidation[J].Applied Physics Letters,2004,85(25):6281-6283.

    [4] X-C YUAN,W.X YU,N.Q.NGO,et al.Cost-effective fabrication ofmicrolenses on hybrid solgel glass with a high-energy beam-sensitive gray-scale mask[J].Opt.Express,2002,10:303-308.

    [5] P.(A)YR(A)S,J.T.RANTALA,R.LEVY,et al.Multilevel structures in soigel thin films with a single UV-exposure using a gray-scale mask[J].Thin Solid films,1999,352:9-12.

    [6] OPPLIGER P.SIXT,J.M.STAUFFER,J.M.MAYER,et al.One-step 3D shaping using a gray-tone mask for optical and microelectronic applications[J].Mieroelectron.Eng,1994,23:449-454.

    CLP Journals

    [1] Chen Tao, Liu Jianhua, Zhang Tan. Error Analysis of the Bending Tube Residual Stress Measurement System Based on Digital Speckle Correlation Method[J]. Laser & Optoelectronics Progress, 2011, 48(11): 111201

    [2] ZHU Meng, LONG Ningbo, ZHANG Hao, HUANG Zhanhua. Eddy Current Sensor Output Curves Calibration by Speckle Correlation[J]. Opto-Electronic Engineering, 2013, 40(10): 17

    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Filling factor fast detecting method for microlens array[J]. Opto-Electronic Engineering, 2007, 34(6): 53
    Download Citation