• Infrared and Laser Engineering
  • Vol. 48, Issue 7, 742001 (2019)
Wang Peng, Xue Dongbai, Zhang Hao, Yang Kun, Li Weihao, and Hui Changshun
Author Affiliations
  • [in Chinese]
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    DOI: 10.3788/irla201948.0742001 Cite this Article
    Wang Peng, Xue Dongbai, Zhang Hao, Yang Kun, Li Weihao, Hui Changshun. ESCV cutting method during infrared crystal single point diamond turning process[J]. Infrared and Laser Engineering, 2019, 48(7): 742001 Copy Citation Text show less

    Abstract

    Single Point Diamond Turing(SPDT) technology has been widely used in the infrared optical surface manufacturing field. However, the micro-nano texture of turned surface is influenced by the turning parameters, the infrared material properties, tip′s parameters of the diamond tools and so on. Based on the detailed analyses of the factors which will affect the turned surface quality during the infrared optical surface SPDT process, a new type of cutting movement that called Evenly tool marks Space and Constant linear Velocity(ESCV) cutting method was proposed for obtaining high surface quality in the paper. The principle of the ESCV method was introduced in detail, the process of cutting parameters determination of the ESCV was given out, and the curve of spindle speed and federate of the ESCV was simulated based on the cutting parameters. A CVD ZnS workpiece was turned via ESCV method, it′s best cutting linear velocity was 3.14 m/s, the Ra value of whole surface roughness was decreased from 6.4 nm to 4.1 nm before and after ESCV. The uniform quality turned surface is gained.
    Wang Peng, Xue Dongbai, Zhang Hao, Yang Kun, Li Weihao, Hui Changshun. ESCV cutting method during infrared crystal single point diamond turning process[J]. Infrared and Laser Engineering, 2019, 48(7): 742001
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