[1] HONG B Z, RAY S K. Ceramic column grid array technology with coated solder columns [C]// Proceed 50th ECTC. Seattle, WA, USA. 2000: 1347-1353.
[5] GHAFFARIAN R. CCGA package for space application [J]. Microelec Reliab, 2006, 46(12): 2006-2024.
[7] COFFIN L F. A study of the effect of cyclic thermal stresses on a ductile metal [J]. Trans American Society Mechan Engineers, 1954, 76: 931-950.
[8] MANSON S S. Behavior of materials under conditions of thermal stress [J]. National Advis Comm Aero, 1953, 2933: 1-34.
[9] SOLOMON H D. Low cycle fatigue of 60/40 solder-plastic strain limited versus displacement limited testing [J]. Electronic Packag: Mater Process, 1985: 29-47.
[10] ENGELMAIER W. Fatigue life of leadless chip carrier solder joints during power cycling [J]. IEEE Trans Compon Hybrids Manufactur Tech, 1983, 6(3): 232-237.
[11] KNECHT S, FOX L R. Constitutive relation and creep-fatigue life model for eutectic tin-lead solder [J]. IEEE Trans Compon Hybrids Manufactur Tech, 1990, 13(2): 424-433.
[12] SYED A R. Creep crack growth prediction of solder joints during temperature cycling -an engineering approach [J]. Trans American Soc Mechan Engineer, 1995, 117(6): 116-122.
[13] AKAY H U, PAYDAR N H, BILGIC A. Fatigue life predictions for thermally loaded solder joints using a volume-weighted averaging technique [J]. Trans American Soc Mechan Engineer, 1997, 119(12): 228-235.
[14] DARVEAUX R. Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction [J]. Trans American Soc Mechan Engineer, 2002, 124(9): 116-122.
[15] PAO Y H. A fracture mechanics approach to thermal fatigue life prediction of solder joints [J]. IEEE Trans Compon Hybrids Manufactur Tech, 1992, 15(4): 559-570.
[17] PERKINS A, SITARAMAN S K. Thermo-mechanical failure comparison and evaluation of CCGA and ABGA electronic package [C]// Electronic Compon Techn Conf. Seattle, WA, USA. 2003: 422-430.
[19] DARVEAUX R. Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction [J]. J Electronic Packag, 2002, 124(3): 147-154.
[20] SOLOMON H D. Fatigue of 60/40 solder [J]. IEEE Trans Compon Hybrids Manufactur Tech, 1986, 9(4): 423-432.
[21] STRICKLAN S M, HESTER J D, GOWAN A K, et al. Microcoil spring interconnects for ceramic grid array integrated circuits [Z]. NASA Tech Memorandum, 2011.