Compared with different thermal fatigue life prediction models of the packages, the life prediction model suitable for microcoil spring ceramic column grid array (CCGA) packaging was determined. Then the thermal fatigue mechanism of solder column was analyzed. Workbench was used to study the thermal fatigue of solder column under temperature cycle. Compared with the results of different thermal fatigue life prediction models, it showed that prediction model based on strain energy density was more suitable for microcoil spring CCGA. Then, the curves of equivalent stress, plastic strain, average plastic strain energy density and temperature with time were discussed. It indicated that the solder joints reduced its internal thermal stress level and the accumulation of thermal fatigue damage through plastic deformation or energy accumulation at temperature holding stages. At temperature transition stages, the stress and strain of solder joints changed sharply, which was intend to produce thermal fatigue damage.