Author Affiliations
1Laboratory of Information Optics and Opto-Electronic Technology, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China3Integrated Circuit Advanced Process R & D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, Chinashow less
Fig. 1. Schematic of lithographic projection system
Fig. 2. Coding scheme of source and mask. (a) Coding scheme of source; (b) coding scheme of mask
Fig. 3. Illustration of the JADE mutation strategy
Fig. 4. Workflow of proposed method. (a) General flow chart; (b) source or mask optimization; (c) selection operation; (d) evaluation function calculation
Fig. 5. Initial status of objects to be optimized. (a) Mask; (b) source; (c) projector pupil
Fig. 6. Mask, source and projector pupil after optimization by proposed method. (a) Mask; (b) source; (c) projector pupil
Fig. 7. Mask, source, and projector pupil after optimization by SMPO-AI. (a) Mask; (b) source; (c) projector pupil
Fig. 8. Intensity distributions on photoresist top surface. (a) Before optimization; (b) after optimization by SMPO-AI; (c) after optimization by proposed method
Fig. 9. Surface profiles of photoresist. (a) Before optimization; (b) after optimization by SMPO-AI; (c) after optimization by proposed method
Fig. 10. Sectional profiles of photoresist. (a) Before optimization; (b) after optimization by SMPO-AI; (c) after optimization by proposed method
Fig. 11. Convergence curves of two methods. (a) SMPO-AI; (b) proposed method
Fig. 12. Convergence curves of two methods
Fig. 13. Process window before and after optimization. (a) Process window; (b) exposure latitude versus depth of focus
Fig. 14. Optimization results of complex pattern. (a) Target pattern; (b) optimized mask; (c) optimized source; profiles of photoresist (d) before optimization and (e) after optimization; (f) optimized projector pupil
Fig. 15. Sectional diagrams of photoresist morphology before and after optimization of complex pattern. (a) Before optimization; (b) after optimization
Fig. 16. Photoresist morphology after optimization of complex pattern
Fig. 17. Process window after optimization of complex pattern. (a) Process window; (b) exposure latitude versus depth of focus
Fig. 18. Optimization results of SRAM pattern. (a) Target pattern; (b) optimized mask; (c) optimized source; profiles of photoresist (d) before optimization and (e) after optimization; (f) optimized projector pupil
Fig. 19. Process window after optimization of SRAM pattern. (a) Process window; (b) exposure latitude versus depth of focus
Layer | Medium | n | k | Thickness /nm |
---|
1 | Resist | 1.719 | 0.3643 | 94.5 | 2 | SiARC | 1.64 | 0.15 | 32.0 | 3 | SOC | 1.49 | 0.3 | 200 | 4 | Substrate | 0.883 | 2.778 | +∞ |
|
Table 1. Photoresist stack data
Process window | Max DOF /nm | Max EL /% | Max PW | PW area /% |
---|
| EL /% | DOF /nm |
---|
Initial | 141.5 | 6.4 | 4.25 | 84.0 | 100.0 | SMPO-AI | 212.5 | 12.85 | 8.65 | 122.0 | 298.3 | Proposed method | 237.0 | 18.05 | 11.2 | 138.0 | 441.7 |
|
Table 2. Process window before and after optimization