• Laser & Optoelectronics Progress
  • Vol. 59, Issue 17, 1714006 (2022)
Zongbao Shen*, Chuang Li, Pin Li, Lei Zhang, Xiao Wang, and Huixia Liu
Author Affiliations
  • School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu , China
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    DOI: 10.3788/LOP202259.1714006 Cite this Article Set citation alerts
    Zongbao Shen, Chuang Li, Pin Li, Lei Zhang, Xiao Wang, Huixia Liu. Preparation of a Hydrophobic Copper Surface with Excellent Aging Properties Using Laser Shock Imprinting[J]. Laser & Optoelectronics Progress, 2022, 59(17): 1714006 Copy Citation Text show less

    Abstract

    In this study, laser shock imprinting technology was used to prepare a hydrophobic copper foil surface with multilevel grooved microtexture. First, a micro-mold with multilevel groove characteristics was prepared by laser marking. Then, the microtexture of the multilevel groove on the micro-mold was copied to the surface of a workpiece using laser shock imprinting technology. The effects of the number of laser shocks and the thickness of the soft film on the surface morphology and static contact angle of the multilevel grooved microtextured hydrophobic surface of the workpiece were studied. The results show that when the number of laser shocks increases from 1 to 7 and the soft film thickness decreases from 300 μm to 100 μm, the degree of microtexture replication on the workpiece surface gradually increases. Simultaneously, the static contact angle and hydrophobicity of the surface increase. By measuring the microtextured surface elements and components of the workpiece, it is found that the multilevel grooved microtexture of the hydrophobic surface remains unchanged after being placed in air, water, and mass fraction 3.5% NaCl solution for 21 days. It shows that the hydrophobic surface prepared by this process has excellent aging properties.
    Zongbao Shen, Chuang Li, Pin Li, Lei Zhang, Xiao Wang, Huixia Liu. Preparation of a Hydrophobic Copper Surface with Excellent Aging Properties Using Laser Shock Imprinting[J]. Laser & Optoelectronics Progress, 2022, 59(17): 1714006
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