Xiaodong Hu, Yuanlong Li, Shaozhuang Bai, Ke Ma. Research Progress of Laser Application in Material Removal[J]. Laser & Optoelectronics Progress, 2021, 58(5): 0500008
- Laser & Optoelectronics Progress
- Vol. 58, Issue 5, 0500008 (2021)
![Schematics of laser drilling method[3]. (a) Copy method(single pulse); (b) copy method(multi-pulse); (c) contour detour(circumferential cut); (d) contour detour(screw-type)](/richHtml/lop/2021/58/5/0500008/img_1.jpg)
Fig. 1. Schematics of laser drilling method[3]. (a) Copy method(single pulse); (b) copy method(multi-pulse); (c) contour detour(circumferential cut); (d) contour detour(screw-type)
![Laser cutting schematic[11]](/richHtml/lop/2021/58/5/0500008/img_2.jpg)
Fig. 2. Laser cutting schematic[11]
![Laser beam parallel cutting diagram[21]](/Images/icon/loading.gif){kind=icon}
Fig. 3. Laser beam parallel cutting diagram[21]
Fig. 4. Laser ablation effect images[24]. (a) Nanosecond laser; (b) picosecond laser; (c) femtosecond laser
Fig. 5. Cantilever beam rendering[29]
Fig. 6. Schematic of lignin laser lithography technique[32]
Fig. 7. Stainless steel splash illustration[33]. (a) No electromagnetic field; (b) steady magnetic field; (c) rotating magnetic field; (d) steady electromagnetic field; (e) rotating electromagnetic field
Fig. 8. Laser waterjet schematic[35]
Fig. 9. Schematic of electromagnetic field assisted laser groove processing device[36]
Fig. 10. Schematic of physical process of groove forming[36]. (a) Material temperature rise; (b) material melting; (c) melt discharge; (d) base material cooling
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