Review on Wet Etching Technique of Fused Silica Optical Elements

Yuhan Li; Huapan Xiao; Hairong Wang; Xiaoya Liang; Changpeng Li; Xin Ye; Xiaodong Jiang; Xinxiang Miao; Caizhen Yao; Laixi Sun

doi:10.3788/LOP202158.1516026

Journals >Laser & Optoelectronics Progress >Volume 58 >Issue 15 >Page 1516026 > Article

Laser & Optoelectronics Progress
Vol. 58, Issue 15, 1516026 (2021)

Review on Wet Etching Technique of Fused Silica Optical Elements

Yuhan Li¹, Huapan Xiao², Hairong Wang^1、*, Xiaoya Liang¹, Changpeng Li³, Xin Ye^3、**, Xiaodong Jiang³, Xinxiang Miao³, Caizhen Yao³, and Laixi Sun³

Author Affiliations

¹State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an , Shaanxi 710049, China

²College of Mechanical Engineering, Chongqing University, Chongqing 400044, China

³Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang , Sichuan 621900, China

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DOI: 10.3788/LOP202158.1516026 Cite this Article Set citation alerts

Yuhan Li, Huapan Xiao, Hairong Wang, Xiaoya Liang, Changpeng Li, Xin Ye, Xiaodong Jiang, Xinxiang Miao, Caizhen Yao, Laixi Sun. Review on Wet Etching Technique of Fused Silica Optical Elements[J]. Laser & Optoelectronics Progress, 2021, 58(15): 1516026 Copy Citation Text

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Fig. 1. Damage morphologies on fused silica surface. (a) Damage at scratch edge^[20]; (b) morphology of damage initiation site^[23]

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Fig. 2. Laser-induced damage resistance performances before and after fused silica leaching ^[5]. (a) Damage probability; (b) damage density

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Fig. 3. Morphological evolution during etching. (a) Indented pits ^[41]; (b) ground surface^[17]

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Fig. 4. Laser damage growth of HF-etched laser damage sites with different sizes after laser irradiation ^[41].（a）Before irradiation；（b）after irradiation

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Fig. 5. Surface impurity distributions of fused silica measured by TOF-SIMS at different process stages ^[18]. (a) Before leaching; (b) after HNO₃/H₂O₂ leaching; (c) after HF etching 1 μm; (d) after HF etching 10 μm; (e) after HF etching 50 μm

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Fig. 6. Evolution of light intensity distribution on cross-section of optical elements before and after etching ^[20]. (a) (b) Perpendicular to scratch; (c) (d) parallel to scratch

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Fig. 7. Evolution of damage resistance performance of elements during etching. (a) LIDT^[49]; (b) damage probability^[42]; (c) damage density^[18]

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Fig. 8. Damage density comparison after AMP2 and AMP3 processing ^[50]

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Sample	Composition （mass fraction）	Agitation frequency /kHz	LIDT before etching /（J·cm^-2）	LIDT after etching /（J·cm^-2）	LIDT improvement /%	Ref.
Polished surface	HF （2%）+NH₄F （5%）	40‒270	18.15	28.96	59.6	［34］
Polished surface	HF （2.4%）+NH₄F （12%）	-	~17	~22	~30.0	［37］
Polished surface	HF （2.4%） +NH₄F （12%）	1300	~20	~36	~80	［37］
Polished surface	HF （1.7%）	40‒270	22.1	25.7	16.3	［38］
Polished surface	HF （0.4%）+NH₄F （12%）	40‒270	21.3	26.6	24.9	［38］
Polished surface	HF （12%）	-	16.2	30.6	~89	［48］

Table 1. LIDT improvement of fused silica under different etching conditions

Sample	Composite technique	LIDT before etching /（J·cm^-2）	LIDT after etching /（J·cm^-2）	LIDT improvement /%	Ref.
Polished surface	RIE（etching depth of 1 μm）+DCE（etching depth of 3 μm）	25	66	164	［59］
Polished surface	RIE（etching depth of 1 μm）+DCE（etching depth of 3 μm）	20.9	50.8	143	［60］
Polished surface	RIE（etching depth of 5 μm）+DCE（etching depth of 3 μm）	22.7	61.1	169	［61］
Polished surface	RIE（etching depth of 1.5 μm）+DCE（etching depth of 3 μm）	23.2	52.5	126	［62］
Scratch	MRF+HF（etching time of 60 min）	7.8	17.8	128	［63］

Table 2. LIDT improvement of fused silica processed by composite technique

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