• Acta Optica Sinica
  • Vol. 32, Issue 6, 629003 (2012)
Gong Lei1、*, Wu Zhensen2, and Gao Ming1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/aos201232.0629003 Cite this Article Set citation alerts
    Gong Lei, Wu Zhensen, Gao Ming. Analysis of Composite Light Scattering Properties Between Wafers and Many Shapes of Particles with Different Positions[J]. Acta Optica Sinica, 2012, 32(6): 629003 Copy Citation Text show less

    Abstract

    Combing the practical situation of nondestructive examination, the analysis of composite light scattering properties between wafers and many shapes of particles with different positions is shown. Against the half-space problem about wafer and defect particles, the generalized perfectly matched layer (GPML) can work very well. The boundary consistency conditions are given by three waves method. The reciprocity theorem is applied to near-far field extrapolation. The angle distribution of sphere or ellipsoidal defect particles are given. The results show that the influence of inlaid particles on size is more obvious than inside ones. In the large scattering angle, the contribution of the position factor is much more. In the angle of -10°, 30°, 70°, the differential scattering cross section (DSCS) difference about sphere and ellipsoidal particles is more obvious. In the wafer′s nondestructive examination project, the defect position and shape are diagnosed by the scattering field of specific angles.
    Gong Lei, Wu Zhensen, Gao Ming. Analysis of Composite Light Scattering Properties Between Wafers and Many Shapes of Particles with Different Positions[J]. Acta Optica Sinica, 2012, 32(6): 629003
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