[1] Kampas F J. J. Appl. Phys., 1983, 54(5): 2276.

[2] Coburm J W, Chen M. J. Appl. Phys., 1980, 51(6): 3134.

[3] Han Y S, Kim Y K, Jia-Young L. Thin Solid Films, 1997, 310: 39.

[4] Jeon H, Wang Chunlei, Hatta A, et al. Jpn. J. Appl. Phys., 1999, 38: 4500.

[5] Heintze M, Magureanu M, Kettlitz M. J. Appl. Phys., 2002, 92(12): 7022.

[6] Kado Shigeru, Sekine Yasushi, Nozaki Tomohiro, et al. Catalysis Today, 2004, 89： 47.

[7] Wang Dawang, Guo Shuhong, Cui Jinhua, et al. 4th International Symposium on Theoretical and Applied Plasma Chemistry, Ivanovo, Russia, 2005. 313.

[8] Wang Dawang, Ma Tengcai. Plasma Science and Technology, 2006, 8(5)： 585.

[10] Kampas F J. J. Appl. Phys., 1983, 54(5): 2276.

[11] Balestrino G, Marinelli M, Milani E, et al. Appl. Phys. Lett., 1993, 62(8): 879.

[12] Vandevelde T, Nesladek M, Ouaeyhaegens C, et al. Thin Solid Films, 1996, 290-291： 143.

[13] http://physics.nist.gov/cgi-bin/AtData/display.ksh.