RESEARCH ON RELIABILITY DETECTION AND FAULTS DIAGNOSIS OF SPACEBORNE TWTA BASED ON INFRARED THERMAL IMAGING TECHNIQUE

[in Chinese]; [in Chinese]; [in Chinese]

Journals >Journal of Infrared and Millimeter Waves >Volume 23 >Issue 2 >Page 107 > Article

Journal of Infrared and Millimeter Waves
Vol. 23, Issue 2, 107 (2004)

RESEARCH ON RELIABILITY DETECTION AND FAULTS DIAGNOSIS OF SPACEBORNE TWTA BASED ON INFRARED THERMAL IMAGING TECHNIQUE

[in Chinese], [in Chinese], and [in Chinese]

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[in Chinese]

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DOI: Cite this Article

[in Chinese], [in Chinese], [in Chinese]. RESEARCH ON RELIABILITY DETECTION AND FAULTS DIAGNOSIS OF SPACEBORNE TWTA BASED ON INFRARED THERMAL IMAGING TECHNIQUE[J]. Journal of Infrared and Millimeter Waves, 2004, 23(2): 107 Copy Citation Text

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References

[1] Kaplan H. The infrared automatic mass screening(IRAMS)system for printed circuit board diagnosis [ R ]. IEEE International Automatic Testing Conference, 1986: 301-306

[2] Wallin B. Real-Time Temperature on PCBs, hybrids and Microchips. Thermosense ⅩⅢ [ J ]. Proceedings of SPIE,the International Society for Optical Engineering, 1991,1467:180-187

[3] Walcutt J. Thermal imaging critical for today's complex circults[J]. Evaluation Engineering( EE ) , 1993, 50-53

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