[1] Cristea D, Obreja P, Kusko M et al. Fabrication of polymer micro-optical components for integration in silicon MOEMS[J]. Proceedings of SPIE, 6993, 699307(2008).
[2] Saha A, Jiang C M, Martí A A. Carbon nanotube networks on different platforms[J]. Carbon, 79, 1-18(2014).
[3] Cristea D, Craciunoiu F, Caldararu M F. Silicon optoelectronic integrated circuits for MOEMS[J]. Proceedings of SPIE, 4019, 516-525(2000).
[4] Chen Y, Hu X Z, Li W. Upgrading design of high-precision double-sided grinding and polishing machine for large-size silicon wafer[J]. Journal of Zhejiang Ocean University (Natural Science), 29, 586-590(2010).
[5] Guo X G, Guo D M, Kang R K et al. Theoretical study on the monocrystal silicon nanometric grinding process[J]. China Mechanical Engineering, 19, 2847-2851(2008).
[6] Yan J W, Kobayashi F. Laser recovery of machining damage under curved silicon surface[J]. CIRP Annals, 62, 199-202(2013).
[7] Kreimeyer M, Wagner F, Vollertsen F. Laser processing of aluminum-titanium-tailored blanks[J]. Optics and Lasers in Engineering, 43, 1021-1035(2005).
[8] Malinauskas M, Žukauskas A, Hasegawa S et al. Ultrafast laser processing of materials: from science to industry[J]. Light: Science & Applications, 5, e16133(2016).
[9] Wang J S, Liew P J. Repair of ultrasonic machining induced surface/subsurface cracks by laser irradiation[J]. Optics & Laser Technology, 111, 497-508(2019).
[10] Niitsu K, Tayama Y, Kato T et al. Laser recovery of grinding-induced subsurface damage in the edge and notch of a single-crystal silicon wafer[J]. Surface Topography, 7, 015013(2019).
[11] Ren Y M, Zhang Z Y. Influences of initial surface conditions on response characteristics of amorphous silicon films to nanosecond laser irradiation[J]. Micromachines, 12, 807(2021).
[12] Perry T L, Werschmoeller D, Li X C et al. Pulsed laser polishing of micro-milled Ti6Al4V samples[J]. Journal of Manufacturing Processes, 11, 74-81(2009).