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Journals >
Infrared and Laser Engineering >
Volume 49 >
Issue 3 >
Page 0303003 > Article
Infrared and Laser Engineering
Vol. 49, Issue 3, 0303003 (2020)
3D information acquisition technology of integral imaging
Yan Xing and Qionghua Wang
*
Author Affiliations
School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing 100191, China
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DOI:
10.3788/IRLA202049.0303003
Cite this Article
Yan Xing, Qionghua Wang. 3D information acquisition technology of integral imaging[J]. Infrared and Laser Engineering, 2020, 49(3): 0303003
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Fig. 1.
Schematic of integral imaging 3D information acquirement and display processes
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Fig. 2.
Schematic of light field sampling in the integral imaging 3D information acquirement process
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Fig. 3.
Schematic of 3D information acquirement based on telecentric relay system
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Fig. 4.
Schematic and experimental results of two-step pickup method without black zone
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Fig. 5.
Integral imaging pickup method using a sparse camera array
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Fig. 6.
Integral imaging 3D real-time acquirement system using a network camera array
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Fig. 7.
Integral imaging pickup method with randomly distributed cameras
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Fig. 8.
Integral imaging 3D information acquirement process based on depth camera
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Fig. 9.
Integral imaging 3D information acquirement scheme based on multiple structured light
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Fig. 10.
Schematic of multiple orthographic frustum combing algorithm
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Fig. 11.
Schematic of rendering algorithm using backward ray-tracing
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Complexity of system
Pickup speed
Amount of data
Pickup resolution
FOV
EIA quality
Cost
Size
Microlens array
Low
High
Small
Low
Small
Low
Low
Small
Camera array
High
Low
Large
High
Large
High
High
Large
Depth camera
Moderately low
Moderately low
Moderately small
Moderately high
Moderately large
Moderately low
Moderately low
Small
Table 1.
Parameter comparison between three integral imaging 3D information acquisition technologies
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Abstract
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References (62)
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Yan Xing, Qionghua Wang. 3D information acquisition technology of integral imaging[J]. Infrared and Laser Engineering, 2020, 49(3): 0303003
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Paper Information
Special Issue:
Received: Dec. 7, 2019
Accepted: --
Published Online: --
The Author Email: Wang Qionghua (qionghua@buaa.edu.cn)
DOI:
10.3788/IRLA202049.0303003
Recommended Topics
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