Researching

Journals
  • Advanced Photonics
  • Photonics Insights
  • Advanced Photonics Nexus
  • Photonics Research
  • Advanced Imaging
  • View All Journals
  • Chinese Optics Letters
  • High Power Laser Science and Engineering
    • Articles
  • Optics
  • Physics
  • Geography
  • View All Subjects
    • Conferences
  • CIOP
  • HPLSE
  • AP
  • View All Events
    • News
    About CLP
    Search by keywords or author
    Journals >Acta Optica Sinica >Volume 39 >Issue 1 >Page 0122001 > Article
    • Acta Optica Sinica
    • Vol. 39, Issue 1, 0122001 (2019)
    Effect of Thermal Deformation on Imaging Performance for 16 nm Extreme Ultraviolet Lithography Objective
    Yanqiu Li1、*, Yan Liu2, and Lihui Liu1
    Author Affiliations
  • 1 Key Laboratory of Photoelectronic Imaging Technology and System, Ministry of Education, School of Optoelectronics, Beijing Institute of Technology, Beijing 100081, China
  • 2 Beijing Aerospace Institute for Metrology and Measurement Technology, Beijing 100076, China
    • show less
    DOI: 10.3788/AOS201939.0122001 Cite this Article Set citation alerts
    Yanqiu Li, Yan Liu, Lihui Liu. Effect of Thermal Deformation on Imaging Performance for 16 nm Extreme Ultraviolet Lithography Objective[J]. Acta Optica Sinica, 2019, 39(1): 0122001 Copy Citation Text show less
    References
    Abstract
    Get PDF(in Chinese)
    Figures&Tables (16)
    Equations (0)
    References (0)
    Cited By (5)
    Get Citation
    Copy Citation Text
    Yanqiu Li, Yan Liu, Lihui Liu. Effect of Thermal Deformation on Imaging Performance for 16 nm Extreme Ultraviolet Lithography Objective[J]. Acta Optica Sinica, 2019, 39(1): 0122001
    Download Citation
    Set citation alerts for the article
    Tools
    Share
    Set citation alerts for the article
    Save the article for my favorites
    Paper Information
    Recommended Topics
    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology