Optimization Research of Automatic Eutectic Die Attach Parameters for Au80Sn20 Alloy

LI Maosong; HUANG Dazhi; ZHU Hongjiao; HU Qiong

doi:10.13911/j.cnki.1004-3365.210029

Journals >Microelectronics >Volume 51 >Issue 3 >Page 449 > Article

Microelectronics
Vol. 51, Issue 3, 449 (2021)

Optimization Research of Automatic Eutectic Die Attach Parameters for Au80Sn20 Alloy

LI Maosong, HUANG Dazhi, ZHU Hongjiao, and HU Qiong

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[in Chinese]

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DOI: 10.13911/j.cnki.1004-3365.210029 Cite this Article

LI Maosong, HUANG Dazhi, ZHU Hongjiao, HU Qiong. Optimization Research of Automatic Eutectic Die Attach Parameters for Au80Sn20 Alloy[J]. Microelectronics, 2021, 51(3): 449 Copy Citation Text

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References

[6] CUILIK J, NORIS M R. The Au-Sn phase diagrams ［J］. J Alloys Compounds, 1993, 31(2):71-73.

[7] SALAVTORE B, ALAN H. Layer structure and thichness effects on electroplated AuSn bump composition ［J］. IEEE Trans Compon Package Tech, 2006, 29(3): 605-607.

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LI Maosong, HUANG Dazhi, ZHU Hongjiao, HU Qiong. Optimization Research of Automatic Eutectic Die Attach Parameters for Au80Sn20 Alloy[J]. Microelectronics, 2021, 51(3): 449

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