Fabrication of micro-structure by using epoxy-based negative photoresist

[in Chinese]

Journals >Opto-Electronic Engineering >Volume 33 >Issue 11 >Page 36 > Article

Opto-Electronic Engineering
Vol. 33, Issue 11, 36 (2006)

Fabrication of micro-structure by using epoxy-based negative photoresist

[in Chinese]^1、2

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¹[in Chinese]

²[in Chinese]

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[in Chinese]. Fabrication of micro-structure by using epoxy-based negative photoresist[J]. Opto-Electronic Engineering, 2006, 33(11): 36 Copy Citation Text

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References

[1] Maria Nordstr(o)m,Alicia Johansson.Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold[J].Microelectronic Engineering,2005,78-79:152-157.

[2] Sebastian Bütefisch,Volker Seidemann,Stephanus Büttgenbach.Novel micro-pneumatic actuator for MEMS[J].Sensors and

[3] Sang Jeen Hong,SeungkeunChoi,Yoonsu Chol,et al.Characterization of Low-Temperature SU-8 Photoresist Processing for MEMS Applications[A].2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference[C].Hawaii,2004:404-408.

CLP Journals

[1] ZHANG Chun-hui, CHEN Long-jiang, LIANG Yi-yong, YANG Guo-guang. Two-spectrum Method for Measuring the Thickness of Photoresist in Lithography Techniques[J]. Opto-Electronic Engineering, 2009, 36(5): 52

[in Chinese]. Fabrication of micro-structure by using epoxy-based negative photoresist[J]. Opto-Electronic Engineering, 2006, 33(11): 36

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