Lithography is a critical process in advanced integrated circuit manufacturing, transferring circuit patterns from a mask to semiconductor wafers through optical diffraction-interference and photochemical reactions. With the continuous advancement of Moore's Law, the critical dimensions in lithography are gradually shrinking, approaching the resolution limits of lithography equipment. This transition exacerbates the optical proximity effect, leading to deviations between the lithographic images on the wafer and the intended mask patterns. To address this, computational lithography has become essential for correcting these deviations over the past two decades. Recently, inverse lithography technology (ILT) has emerged as a significant advancement. Unlike traditional methods, ILT employs pixel-by-pixel correction and has been integrated into mass production, enhancing process windows, pattern fidelity, and uniformity. This paper introduces the operational principles of ILT, reviews its progress and achievements, explores its applications in various scenarios, and discusses the associated challenges and requirements in process applications. Additionally, it details the mask manufacturing process flow, the challenges in ILT mask production, and the current solutions, concluding with potential future directions for ILT development.