1School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
2Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong, China
3School of Biomedical Sciences, The University of Hong Kong, Hong Kong, China
4Engineering Research Center of Integrated Circuits for Next-Generation Communications, Ministry of Education, Southern University of Science and Technology, Shenzhen 518055, China
5Engineering Research Center of Three Dimensional Integration in Guangdong Province, Southern University of Science and Technology, Shenzhen 518055, China