• Chinese Optics Letters
  • Vol. 16, Issue 9, 091301 (2018)
Kai Liu*, Huize Fan, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, Qi Wei, and Shiwei Cai
Author Affiliations
  • State Key Laboratory of Information Photonics and Optical Communications, Beijing University of Posts and Telecommunications, Beijing 100876, China
  • show less
    DOI: 10.3788/COL201816.091301 Cite this Article Set citation alerts
    Kai Liu, Huize Fan, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, Qi Wei, Shiwei Cai. A pair of integrated optoelectronic transceiving chips for optical interconnects[J]. Chinese Optics Letters, 2018, 16(9): 091301 Copy Citation Text show less
    References

    [1] P.-K. Shen, C.-T. Chen, C.-H. Chang. IEEE Photon. J., 6, 2500310(2014).

    [2] H. Qiu, Z. Wu, T. Deng, Y. He, G. Xia. Chin. Opt. Lett., 14, 021401(2016).

    [3] Y. Feng, L. Hou, Y. Hao, C. Yan, Y. Zhao, Y. Wang, J. Zhong. Chin. Opt. Lett., 8, 773(2010).

    [4] H.-Y. Kao, Y.-C. Chi, C.-T. Tsai, S.-F. Leong, C.-Y. Peng, H.-Y. Wang, J. J. Huang, J.-J. Jou, T.-T. Shih, H.-C. Kuo, W.-H. Cheng, C.-H. Wu, G.-R. Lin. Photon. Res., 5, 507(2017).

    [5] M. Riester, R. Houbertz. Proceedings of World Telecommunications Congress, 1(2014).

    [6] F.-M. Kuo, T.-C. Hsu, J.-W. Shi. OFC, 1(2009).

    [7] T. Shi, B. Xiong, C. Sun, Y. Luo. Chin. Opt. Lett., 9, 082302(2011).

    [8] H. Nasu, T. Kise, K. Nagashima, N. Nishimura. The European Conference on Optical Communication (ECOC), Tu.4.5.2(2014).

    [9] S. Shimizu, X. Gu, T. Shimada. 2nd IEEE CPMT Symposium Japan, 1(2012).

    [10] X. Li, F. Yang, F. Zhong, Q. Deng, M. Jurgen, Z. Zhou. Photon. Res., 5, 134(2017).

    [11] B.-M. Yu, M. Shin, M.-H. Kim, L. Zimmermann, W.-Y. Choi. Chin. Opt. Lett., 15, 071301(2017).

    [12] G. Hasnain, K. Tai, Y. H. Wang, J. D. Wynn, K. D. Choquette, B. E. Weir, N. K. Durra, A. Y. Cho. Electron. Lett., 27, 1630(1991).

    [13] G. G. Ortiz, C. P. Hains, J. Cheng, H. Q. Hou, J. C. Zolper. Electron. Lett., 32, 1205(1996).

    [14] F. E. Doany, C. L. Schow, C. W. Baks, D. M. Kuchta. IEEE Trans. Adv. Packag., 32, 345(2009).

    [15] J. Mi, H. Yu, H. Wang, S. Tan. IEEE Photon. Technol. Lett., 27, 169(2015).

    [16] P.-K. Shen, C.-T. Chen, S.-L. Li, C.-H. Chang, S.-H. Lin, C.-C. Chang, H.-C. Lan, M.-L. Wu. 18th Microoptics Conference (MOC’13), 1(2013).

    [17] E. J. Norberg, B. R. Koch, J. E. Roth, A. Ramaswamy, R. S. Guzzon, D. K. Sparacin, G. A. Fish. IEEE Photonics Conferrence (IPC), 351(2015).

    [18] H. Wenzel, H.-J. Wunsche. IEEE J. Quantum Electron., 33, 1156(1997).

    [19] Z.-M. Li, K. M. Dzurko, A. Dellge, S. P. McAlister. IEEE J. Quantum Electron., 28, 1209(1992).

    CLP Journals

    [1] Kai Liu, Qi Wei, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, Shiwei Cai. Integrated optoelectronic chip pair for transmitting and receiving optical signals simultaneously[J]. Chinese Optics Letters, 2019, 17(4): 041301

    Data from CrossRef

    [1] Qi Wei, Kai Liu, Jun-Wei Luo, Hui-Ze Fan, Xiao-Min Ren, Yong-Qing Huang, Jia-Rui Fei, Xiao-Feng Duan, Qi Wang, Shi-Wei Cai. Monolithic integration of VCSEL and coupled cavity RCEPD for short-reach single-fiber bi-directional optical interconnects. The European Physical Journal D, 73, 186(2019).

    Kai Liu, Huize Fan, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, Qi Wei, Shiwei Cai. A pair of integrated optoelectronic transceiving chips for optical interconnects[J]. Chinese Optics Letters, 2018, 16(9): 091301
    Download Citation