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    Journals >Chinese Journal of Lasers >Volume 14 >Issue 10 >Page 635 > Article
    • Chinese Journal of Lasers
    • Vol. 14, Issue 10, 635 (1987)
    Laser enhanced copper plating
    Yuan Jiayong, Li Shijie, Wang Jinghuan, Wang Maoxin, Qin Liang, and Chen Qi
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    Yuan Jiayong, Li Shijie, Wang Jinghuan, Wang Maoxin, Qin Liang, Chen Qi. Laser enhanced copper plating[J]. Chinese Journal of Lasers, 1987, 14(10): 635 Copy Citation Text show less

    Abstract

    The mechanism and experimental method for laser enhanced plating are described. With this new technique we got spots and lines of copper plated on glass substrates-. A plating rate of 0.1-lum/s and plating enhancement ratio on the order of 103 have been obtained.
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    Yuan Jiayong, Li Shijie, Wang Jinghuan, Wang Maoxin, Qin Liang, Chen Qi. Laser enhanced copper plating[J]. Chinese Journal of Lasers, 1987, 14(10): 635
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    Paper Information
    Recommended Topics
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