• Opto-Electronic Engineering
  • Vol. 44, Issue 10, 1014 (2017)
Lei Ni, Baorui Huang, and Peilin Li
Author Affiliations
  • [in Chinese]
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    DOI: 10.3969/j.issn.1003-501x.2017.10.010 Cite this Article
    Lei Ni, Baorui Huang, Peilin Li. Measurement of cryogenic thermal expansion coefficient and accuracy analysis[J]. Opto-Electronic Engineering, 2017, 44(10): 1014 Copy Citation Text show less

    Abstract

    In order to realize the high-precision measurement of the thermal expansion coefficient of the infrared material under the cryogenic vacuum environment, a measurement scheme of solid material is proposed. Based on the self-collimation principle, this scheme designs a microstructure, establishes the relationship between structural deformation and angle, and deduces the formula of thermal expansion coefficient measurement. Us-ing the measurement formula, this article analyzes the relationship between the measurement error transfer function of the scheme, and also uses the error sensitivity function to analyze the design accuracy of cryogenic thermal expansion coefficient measuring device for infrared materials, and finally the relative error of the scheme is calculated. The thermal expansion coefficient of the scheme is measured to be only 0.76%, which satisfies the nanometer measurement requirement.
    Lei Ni, Baorui Huang, Peilin Li. Measurement of cryogenic thermal expansion coefficient and accuracy analysis[J]. Opto-Electronic Engineering, 2017, 44(10): 1014
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