Author Affiliations
Institute of Laser Engineering, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, Chinashow less
Fig. 1. COMSOL simulation results. (a) Diameter of microsphere is 5 µm; (b) diameter of microsphere is 1 µm
Fig. 2. Effects of microsphere diameter and laser wavelength on machining accuracy
Fig. 3. Schematic diagram of experimental process
Fig. 4. Silica microsphere monolayer dense array
Fig. 5. Schematic diagram of laser light path
Fig. 6. Effect of laser wavelength on gold film structure (25 nm gold film, 4.82 µm microspheres and 10 mJ/cm2 energy density). (a) 532 nm; (b) 355 nm; (c) 266 nm; (d) variation of hole diameter on gold film with energy density at different wavelengths
Fig. 7. Effect of microsphere diameter on gold film structure (532 nm laser, 25 nm gold film and 30 mJ/cm2 energy density). (a) 4.82 µm; (b) 2.53 µm; (c) 1.49 µm; (d) variation of hole diameter on gold film with energy density under different microsphere diameters
Fig. 8. Effect of gold film thickness on gold film structure (532 nm laser, 4.82 µm microspheres and 20 mJ/cm2 energy density). (a) 10 nm; (b) 25 nm; (c) 40 nm; (d) variation of hole diameter on gold film with energy density under different gold film thicknesses
Fig. 9. Processed holes with diameter about 100 nm at optimal parameter (laser wavelength is 532 nm, gold film thickness is 25 nm, microsphere diameter is 1.49 μm and laser energy density is 25 mJ/cm2)
Fig. 10. Effect of step on line processing. (a) Only one point is machined; (b) machining step is 400 nm; (c) machining step is 800 nm; (d) machining step is 1200 nm
Fig. 11. Effect of energy density on line processing. (a) Energy density is 25 mJ/cm2; (b) energy density is 23 mJ/cm2; (c) energy density is 20 mJ/cm2
Fig. 12. Processed patterns. (a) Processed pattern
T
on 4.82 µm microsphere; (b) processed pattern
C
on 4.82 µm microsphere; (c) processed pattern
O
on 2.53 µm microsphere
No. | Wavelength /nm | Diameter of dielectric microspheres /µm | Thickness of goldfilm /nm | Critical energy density ofpore-out /(mJ·cm-2) | Gold film holediameter /nm |
---|
1 | 266 | 4.82 | 10 | 4 | 1200 | 2 | 355 | 4.82 | 10 | 8 | 1000 | 3 | 532 | 4.82 | 10 | 20 | 1600 | 4 | 266 | 4.82 | 25 | 6 | 1000 | 5 | 355 | 4.82 | 25 | 8 | 500 | 6 | 532 | 4.82 | 25 | 25 | 300 | 7 | 266 | 4.82 | 40 | 8 | 800 | 8 | 355 | 4.82 | 40 | 15 | 600 | 9 | 532 | 4.82 | 40 | 40 | 1300 | 10 | 266 | 2.53 | 10 | 4 | 800 | 11 | 355 | 2.53 | 10 | 6 | 800 | 12 | 532 | 2.53 | 10 | 20 | 600 | 13 | 266 | 2.53 | 25 | 6 | 500 | 14 | 355 | 2.53 | 25 | 8 | 400 | 15 | 532 | 2.53 | 25 | 25 | 200 | 16 | 266 | 2.53 | 40 | 8 | 1000 | 17 | 355 | 2.53 | 40 | 15 | 1300 | 18 | 532 | 2.53 | 40 | 40 | 1300 | 19 | 266 | 1.49 | 10 | 4 | 500 | 20 | 355 | 1.49 | 10 | 6 | 400 | 21 | 532 | 1.49 | 10 | 20 | 200 | 22 | 266 | 1.49 | 25 | 6 | 200 | 23 | 355 | 1.49 | 25 | 8 | 150 | 24 | 532 | 1.49 | 25 | 25 | 100 | 25 | 266 | 1.49 | 40 | 10 | 300 | 26 | 355 | 1.49 | 40 | 25 | 250 | 27 | 532 | 1.49 | 40 | 45 | 400 |
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Table 1. Critical energy density of pore-out under different process parameters and hole diameter of gold film processed under the energy density