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Journals >
Journal of Inorganic Materials >
Volume 36 >
Issue 4 >
Page 347 > Article
Journal of Inorganic Materials
Vol. 36, Issue 4, 347 (2021)
Application of Entropy Engineering in Thermoelectrics
Qingyu YANG
1、2
, Pengfei QIU
1、2
, Xun SHI
1、2、*
, and Lidong CHEN
1、2
Author Affiliations
1
1. Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
2
2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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DOI:
10.15541/jim20200417
Cite this Article
Qingyu YANG, Pengfei QIU, Xun SHI, Lidong CHEN.
Application of Entropy Engineering in Thermoelectrics
[J]. Journal of Inorganic Materials, 2021, 36(4): 347
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1. Schematic of entropy engineering in thermoelectrics
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2. Room-temperature Seebeck coefficient as a function of configurational entropy in Cu
2
(S/Se/Te)-based multicomponent materials
[
10
]
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3. Lattice thermal conductivity as a function of configurational entropy for typical TE materials
[
10
,
39
-
40
]
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4. TE figure of merit as a function of configurational entropy for typical TE materials
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5. Carrier concentration dependence of room-temperature Seebeck coefficient in Cu
2
(S/Se/Te)-based TE materials with different crystal symmetry
[
10
]
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6. (a) Seebeck coefficient and (b) lattice thermal conductivity as a function of configurational entropy in (Sn, Ge, Pb, Mn)Te-based materials
[
39
]
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7. Gibbs free energy as a function of the average solubility parameter$(\bar{\delta })$for given multicomponent TE materials with different number of components
[
10
]
(1 Å = 0.1 nm)
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8. Enthalpy as a function of the number of components for typical TE materials
[
10
]
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Abstract
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Figures&Tables (8)
Equations (6)
References (70)
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Qingyu YANG, Pengfei QIU, Xun SHI, Lidong CHEN.
Application of Entropy Engineering in Thermoelectrics
[J]. Journal of Inorganic Materials, 2021, 36(4): 347
Download Citation
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Paper Information
Category: REVIEW
Received: Jul. 27, 2020
Accepted: --
Published Online: Apr. 20, 2021
The Author Email: SHI Xun (xshi@mail.sic.ac.cn)
DOI:
10.15541/jim20200417
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