[1] GUHA K, SRAVANI G, KARUMURI S R. Design and optimization of a novel structure capacitive RF MEMS switch to integrate with an antenna to improve its performance parameters ［J］. IET Circ Dev & Syst, 2020, 14(3): 276-287.

[2] BAEHR U, FREIER M, LEWIS M, et al. Frequency induced stiction for MEMS accelerometers ［J］. J Microelectromechan Syst, 2020, 29(3): 285-295.

[3] OZDOGAN M, TOWFIGHIAN S, MILES R N, et al. Modeling and characterization of a pull-in free MEMS microphone ［J］. IEEE Sensors J, 2020, 20(12): 6314-6323.

[4] YAN H, LIAO X, CHEN C, et al. An integrated microwave detector based on MEMS technology for X-band application ［J］. IEEE Elec Dev Lett, 2018, 39(5): 742-745.

[5] GAO B, YANG J, JIANG S, et al. Application of the thermoelectric MEMS microwave power sensor in a power radiation monitoring system ［J］. J Semicond, 2016, 37(8): 64-66.

[6] FERNANDEZ L J, WIEGERINK R J, FLOKSTRA J, et al. A capacitive RF power sensor based on MEMS technology ［J］. J Micromechan & Microengineer, 2006, 16(7): 1099-1107.

[7] CUI Y, LIAO X. Modeling and design of a capacitive microwave power sensor for X-band applications based on GaAs technology ［J］. J Micromechan & Microengineer, 2012, 22(5): 055013.

[8] HAN J, LIAO X. A 0.1-40 GHz broadband MEMS clamped-clamped beam capacitive power sensor based on GaAs technology ［J］. J Micromechan & Microengineer, 2014, 24(6): 065024.

[9] ZHANG Z, LIAO X. An inline RF power sensor based on fixed capacitive coupling for GaAs MMIC applications ［J］. IEEE Sensors J, 2015, 15(2): 665-666.

[10] YI Z, YAN H, YAN J, et al. Fabrication of the differential microwave power sensor by seesaw-type MEMS membrane ［J］. J Microelectromechan Syst, 2016, 25(4): 582-584.