A Kind of ESD Protection Technology Using System in Package

LI Bo; LI Jianzhuang; GAN Xuchun; HUANG Xiaozong

doi:10.13911/j.cnki.1004-3365.200305

Journals >Microelectronics >Volume 51 >Issue 2 >Page 211 > Article

Microelectronics
Vol. 51, Issue 2, 211 (2021)

A Kind of ESD Protection Technology Using System in Package

LI Bo, LI Jianzhuang, GAN Xuchun, and HUANG Xiaozong

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[in Chinese]

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DOI: 10.13911/j.cnki.1004-3365.200305 Cite this Article

LI Bo, LI Jianzhuang, GAN Xuchun, HUANG Xiaozong. A Kind of ESD Protection Technology Using System in Package[J]. Microelectronics, 2021, 51(2): 211 Copy Citation Text

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References

[1] TAMMINEN P, VIHERIAKOSKI T, UKKONEN L, et al. ESD and disturbance cases in electrostatic protected areas ［C］ ∥ 37th EOS/ESD. Reno, NV, USA. 2015: 1-7.

[6] TAMMINEN P, SYDANHEIM T, UKKONEN L. ESD sensitivity of 01005 chip resistors and capacitors ［C］ ∥ 36th EOS/ESD. Tucson, AZ, USA. 2014: 1-9.

[8] Texas Instruments. Application report SLAA530, MSP430TM system-level ESD considerations ［Z］. 2012.

LI Bo, LI Jianzhuang, GAN Xuchun, HUANG Xiaozong. A Kind of ESD Protection Technology Using System in Package[J]. Microelectronics, 2021, 51(2): 211

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