• Laser & Optoelectronics Progress
  • Vol. 56, Issue 1, 011405 (2019)
Xuehui Chen*, Xiang Li, Chao Wu, and Yao Zhang
Author Affiliations
  • College of Mechanical and Electrical Engineering, Anhui Jianzhu University, Hefei, Anhui 230601, China
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    DOI: 10.3788/LOP56.011405 Cite this Article Set citation alerts
    Xuehui Chen, Xiang Li, Chao Wu, Yao Zhang. Influence of Water Jet Assisted Laser Processing Silicon Carbide[J]. Laser & Optoelectronics Progress, 2019, 56(1): 011405 Copy Citation Text show less

    Abstract

    In order to investigate the effects of a water jet with a certain speed and angle on the depth, width and heat affected zone of the processed groove in the water jet-assisted laser machining of silicon carbide. The Fluent software is used to simulate the effect of water jets at different speeds and different angles of incidence on the surface impact of the material. The impact of impact force on processing results is theoretically analyzed. At the same time, the relevant experiments are carried out for verification. The results show that when the water jet velocity is the same, the impact force on the surface of the groove gradually increases as the incident angle of the jet increases. Compared with the waterless laser processing, the water jet assisted laser processing has a great influence on the depth of the obtained groove, the effect of the width is small, and the heat affected zone is significantly reduced. There are less slag and re-condensation layer at the bottom and notch of the groove, thus the processing quality is better.
    Xuehui Chen, Xiang Li, Chao Wu, Yao Zhang. Influence of Water Jet Assisted Laser Processing Silicon Carbide[J]. Laser & Optoelectronics Progress, 2019, 56(1): 011405
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