• Microelectronics
  • Vol. 52, Issue 1, 125 (2022)
DAI Yang1, YE Qingsong1, DANG Jiangtao1, LU Zhaoyang1, ZHANG Weiwei2, LEI Xiaoyi1, ZHANG Yunyao1, LIAO Chenguang1, ZHAO Shenglei3, and ZHAO Wu1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    DOI: 10.13911/j.cnki.1004-3365.210238 Cite this Article
    DAI Yang, YE Qingsong, DANG Jiangtao, LU Zhaoyang, ZHANG Weiwei, LEI Xiaoyi, ZHANG Yunyao, LIAO Chenguang, ZHAO Shenglei, ZHAO Wu. Study on RF Performance of SiC/GaN IMPATT Diode[J]. Microelectronics, 2022, 52(1): 125 Copy Citation Text show less

    Abstract

    A p-SiC/n-GaN heterojunction double drift (DDR) IMPATT diode was fabricated while p-GaN was replaced by wide bandgap p-SiC. The output characteristics of AC large signal were simulated numerically. The results showed that compared with the traditional GaN single drift (SDR) IMAPTT diode, the breakdown voltage, optimal negative conductance, AC power density and DC-AC conversion efficiency of the new p-SiC/N-GaN DDR device were significantly improved, and the device had a wider oscillation frequency band. The new structure of the device had significant application potential in AC power density, which reached 1.97 MW/cm2. The diode was based on the wide gap semiconductor material, which provided reference value for the design and manufacture of GaN and SiC IMPATT device.
    DAI Yang, YE Qingsong, DANG Jiangtao, LU Zhaoyang, ZHANG Weiwei, LEI Xiaoyi, ZHANG Yunyao, LIAO Chenguang, ZHAO Shenglei, ZHAO Wu. Study on RF Performance of SiC/GaN IMPATT Diode[J]. Microelectronics, 2022, 52(1): 125
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