Lin Zhao, Xiaodong Zhang, Lihua Lei, Qun Yuan, Suoyin Li, Faguo Liang, Aihua Wu. A hybrid high-aspect-ratio trench standard template[J]. Infrared and Laser Engineering, 2023, 52(4): 20220646
- Infrared and Laser Engineering
- Vol. 52, Issue 4, 20220646 (2023)
Fig. 1. Graphic design scheme of standard template
Fig. 2. Process design flow chart of high-aspect-ratio trench standard template
Fig. 3. Process flow chart of SOI chip processing
Fig. 4. (a) Physical map of the standard template; (b) Scribing map of the standard template
Fig. 5. Schematic diagram of the characterization position and uniformity assessment of the high-aspect-ratio trench standard template
Fig. 6. Location map of wafer sample uniformity assessment
Fig. 7. Definition of groove depth measurement
Fig. 8. Measurement result of the standard template sample under SEM
Fig. 9. Uniformity measurement results of a sample template with a line width of 2 μm and a trench depth of 10 μm
Fig. 10. Uniformity measurement results of a sample template with a line width of 2 μm and a trench depth of 60 μm
Fig. 11. Uniformity measurement results of a sample template with a line width of 30 μm and a trench depth of 200 μm
Fig. 12. Uniformity measurement results of a sample template with a line width of 30 μm and a trench depth of 300 μm
Fig. 13. Measurement results of the 30-300 μm standard sample template in the near-infrared broad-spectrum interference microscopy measurement system
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Table 1. Nominal size and aspect ratio of design standard template
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Table 2. Comparison of sample template setting results and measurement results
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