• Infrared and Laser Engineering
  • Vol. 51, Issue 6, 20210640 (2022)
Renjie Ruan1、2、3, Yinhua Cao1、2、3, Xiaofan Wang1、2、3, Yanhong Ma1、2、3, Zhiyong Wang1、2、3, and Tian Lan1、2、3、*
Author Affiliations
  • 1Beijing Engineering Research Center of Laser Technology, Beijing University of Technology, Beijing 100124, China
  • 2Key Laboratory of Trans-scale Laser Manufacturing Technology, Ministry of Education, Beijing University of Technology, Beijing 100124, China
  • 3Institute of Advanced Technology on Semiconductor Optics & Electronics, Department of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China
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    DOI: 10.3788/IRLA20210640 Cite this Article
    Renjie Ruan, Yinhua Cao, Xiaofan Wang, Yanhong Ma, Zhiyong Wang, Tian Lan. Design of on-chip dot array structured light projector using bottom-emitting VCSEL[J]. Infrared and Laser Engineering, 2022, 51(6): 20210640 Copy Citation Text show less
    References

    [1] Z Song, S Tang, F Gu, et al. DOE-based structured-light method for accurate 3D sensing. Optics and Lasers in Engineering, 120, 21-30(2019).

    [2] Zuberi F A, Khatri S, Junejo K N. Dynamic gesture recognition using machine learning techniques facts affecting its accuracy [C]2016 Sixth International Conference on Innovative Computing Technology (INTECH). IEEE, 2016: 310313.

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    [6] C Zuo, X L Zhang, Y Hu, . Has 3D finally come of age? ——An introduction to 3D structured-light sensor. Infrared and Laser Engineering, 49, 0303001(2020).

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    [9] H Pang, S Y Yin, Q L Deng, et al. A novel method for the design of diffractive optical elements based on the Rayleigh-Sommerfeld integral. Optics and Lasers in Engineering, 70, 38-44(2015).

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    [13] Zhao Yongshun. Diffractive optical element design f generating pointarray structured light [D].Harbin: Harbin Institute of Technology, 2019. (in Chinese)

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    Renjie Ruan, Yinhua Cao, Xiaofan Wang, Yanhong Ma, Zhiyong Wang, Tian Lan. Design of on-chip dot array structured light projector using bottom-emitting VCSEL[J]. Infrared and Laser Engineering, 2022, 51(6): 20210640
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