• Infrared and Laser Engineering
  • Vol. 50, Issue 5, 20200326 (2021)
Bin Liu1、2, Qian Qiao1、2, Jing Zhao1、2, Zimiao Zhang3、*, Zhiwei Li1、2, and Baofeng Zhang1、2
Author Affiliations
  • 1Tianjin Key Laboratory of Control Theory & Applications in Complicated System, Tianjin University of Technology, Tianjin 300384, China
  • 2School of Electrical and Electronic Engineering, Tianjin University of Technology, Tianjin 300384, China
  • 3Tianjin Key Laboratory of High Speed Cutting & Precision Machining, Tianjin University of Technology and Education, Tianjin 300222, China
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    DOI: 10.3788/IRLA20200326 Cite this Article
    Bin Liu, Qian Qiao, Jing Zhao, Zimiao Zhang, Zhiwei Li, Baofeng Zhang. 3D profile measurement based on depth from focus method using high-frequency component variance weighted entropy image sharpness evaluation function[J]. Infrared and Laser Engineering, 2021, 50(5): 20200326 Copy Citation Text show less
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    Bin Liu, Qian Qiao, Jing Zhao, Zimiao Zhang, Zhiwei Li, Baofeng Zhang. 3D profile measurement based on depth from focus method using high-frequency component variance weighted entropy image sharpness evaluation function[J]. Infrared and Laser Engineering, 2021, 50(5): 20200326
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