• Laser & Optoelectronics Progress
  • Vol. 59, Issue 1, 0114013 (2022)
Zhichao Dong1, Ting Liang1、*, Cheng Lei1, Kaixun Gong1, Xuezhan Wu1, and Lei Qi2
Author Affiliations
  • 1Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, School of Instrument and Electronics, North University of China, Taiyuan , Shanxi 030051, China
  • 2Northern Institute of Automatic Control Technology, Taiyuan , Shanxi 030051, China
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    DOI: 10.3788/LOP202259.0114013 Cite this Article Set citation alerts
    Zhichao Dong, Ting Liang, Cheng Lei, Kaixun Gong, Xuezhan Wu, Lei Qi. Influence of Optical Element Heat Absorption on Focus Position of Equipment in Semiconductor Laser Processing[J]. Laser & Optoelectronics Progress, 2022, 59(1): 0114013 Copy Citation Text show less
    Laser focusing system model
    Fig. 1. Laser focusing system model
    Laser beam distribution
    Fig. 2. Laser beam distribution
    Temperature distribution on lens surface
    Fig. 3. Temperature distribution on lens surface
    Stress and deformation of lens
    Fig. 4. Stress and deformation of lens
    Deposition power. (a) Deposition power of the lens; (b) deposition power on target surface
    Fig. 5. Deposition power. (a) Deposition power of the lens; (b) deposition power on target surface
    Refractive index change of focusing lens
    Fig. 6. Refractive index change of focusing lens
    Relationship between RMS of point size and position of focal plane. (a) Overall change curves; (b) enlargement in Fig. 7(a)
    Fig. 7. Relationship between RMS of point size and position of focal plane. (a) Overall change curves; (b) enlargement in Fig. 7(a)
    Spot diagram of beam on the best focal plane
    Fig. 8. Spot diagram of beam on the best focal plane
    Experimental device. (a) Ultraviolet laser processing equipment; (b) ultraviolet laser instrument; (c) processing platform
    Fig. 9. Experimental device. (a) Ultraviolet laser processing equipment; (b) ultraviolet laser instrument; (c) processing platform
    Change of focusing spot. (a) Light spot at initial position; (b) stabilized light spot
    Fig. 10. Change of focusing spot. (a) Light spot at initial position; (b) stabilized light spot
    Morphologies of cutting areas. (a) Initial cutting area; (b) transition area; (c) initial stable area; (d) ending stable area
    Fig. 11. Morphologies of cutting areas. (a) Initial cutting area; (b) transition area; (c) initial stable area; (d) ending stable area
    Measurement results of step profiler. (a) Measuring position of step profiler; (b) step morphology
    Fig. 12. Measurement results of step profiler. (a) Measuring position of step profiler; (b) step morphology
    Morphologies of transition area. (a) 2D morphology; (b) 3D morphology
    Fig. 13. Morphologies of transition area. (a) 2D morphology; (b) 3D morphology
    Processing depth (ten times). (a) Initial cutting area; (b) stable area
    Fig. 14. Processing depth (ten times). (a) Initial cutting area; (b) stable area
    Zhichao Dong, Ting Liang, Cheng Lei, Kaixun Gong, Xuezhan Wu, Lei Qi. Influence of Optical Element Heat Absorption on Focus Position of Equipment in Semiconductor Laser Processing[J]. Laser & Optoelectronics Progress, 2022, 59(1): 0114013
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