• Acta Optica Sinica
  • Vol. 43, Issue 11, 1113002 (2023)
Guangying Zhou1、3, Yuejing Qi1、3、*, Liang Li2, Miao Jiang2, Jiangliu Shi2, and Mingyi Yao1、3
Author Affiliations
  • 1Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China
  • 2Beijing Superstring Academy of Memory Technology, Beijing 100176, China
  • 3University of Chinese Academy of Sciences, Beijing 100049, China
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    DOI: 10.3788/AOS222161 Cite this Article Set citation alerts
    Guangying Zhou, Yuejing Qi, Liang Li, Miao Jiang, Jiangliu Shi, Mingyi Yao. Robustness Analysis Method and Simulation Research of Alignment Mark[J]. Acta Optica Sinica, 2023, 43(11): 1113002 Copy Citation Text show less
    Schematic diagram for layered processing of alignment mark
    Fig. 1. Schematic diagram for layered processing of alignment mark
    Front view of AH53 mark
    Fig. 2. Front view of AH53 mark
    5th order diffraction efficiency at different harmonic numbers
    Fig. 3. 5th order diffraction efficiency at different harmonic numbers
    Curves of wafer quality and signal-to-noise ratio changing with groove depth. (a) Wafer quality;(b) signal-to-noise ratio
    Fig. 4. Curves of wafer quality and signal-to-noise ratio changing with groove depth. (a) Wafer quality;(b) signal-to-noise ratio
    Curves of wafer quality and signal-to-noise ratio changing with groove width. (a) Wafer quality;(b) signal-to-noise ratio
    Fig. 5. Curves of wafer quality and signal-to-noise ratio changing with groove width. (a) Wafer quality;(b) signal-to-noise ratio
    Curves of wafer quality and signal-to-noise ratio changing with resist. (a) Wafer quality; (b) signal-to-noise ratio
    Fig. 6. Curves of wafer quality and signal-to-noise ratio changing with resist. (a) Wafer quality; (b) signal-to-noise ratio
    Curves of wafer quality and signal-to-noise ratio changing with oxide layer. (a) Wafer quality; (b) signal-to-noise ratio
    Fig. 7. Curves of wafer quality and signal-to-noise ratio changing with oxide layer. (a) Wafer quality; (b) signal-to-noise ratio
    Schematic diagrams of sidewall deformation. (a) Sidewall angle;(b) sidewall of arc
    Fig. 8. Schematic diagrams of sidewall deformation. (a) Sidewall angle;(b) sidewall of arc
    The influence of the number of layers on the calculation accuracy under different sidewall angles. (a) 120°; (b) 110°; (c) 100°
    Fig. 9. The influence of the number of layers on the calculation accuracy under different sidewall angles. (a) 120°; (b) 110°; (c) 100°
    The influence of number of harmonic on calculation accuracy under different sidewall angles
    Fig. 10. The influence of number of harmonic on calculation accuracy under different sidewall angles
    Curves of wafer quality and signal-to-noise ratio changing with sidewall angle. (a) Wafer quality; (b) signal-to-noise ratio
    Fig. 11. Curves of wafer quality and signal-to-noise ratio changing with sidewall angle. (a) Wafer quality; (b) signal-to-noise ratio
    Schematic diagrams of sidewall of arc. (a) Sidewall of concave arc; (b) sidewall of convex arc
    Fig. 12. Schematic diagrams of sidewall of arc. (a) Sidewall of concave arc; (b) sidewall of convex arc
    Curves of wafer quality and signal-to-noise ratio changing with sidewall of concave arc. (a) Wafer quality; (b) signal-to-noise ratio
    Fig. 13. Curves of wafer quality and signal-to-noise ratio changing with sidewall of concave arc. (a) Wafer quality; (b) signal-to-noise ratio
    Curves of wafer quality and signal-to-noise ratio changing with sidewall of convex arc. (a) Wafer quality; (b) signal-to-noise ratio
    Fig. 14. Curves of wafer quality and signal-to-noise ratio changing with sidewall of convex arc. (a) Wafer quality; (b) signal-to-noise ratio
    Schematic diagram of asymmetric mark
    Fig. 15. Schematic diagram of asymmetric mark
    Comparison of simulation results of two methods
    Fig. 16. Comparison of simulation results of two methods
    Marked wafer quality measurement
    Fig. 17. Marked wafer quality measurement
    Cross section of mark
    Fig. 18. Cross section of mark
    Comparison between simulation results and experimental results
    Fig. 19. Comparison between simulation results and experimental results
    Incident wavelength /nmPolarization state
    532TE
    633TM
    780TE
    852TM
    Table 1. Wavelength and polarization state of incident light
    Incident wavelength /nmDiffraction efficiency of -5th /%Diffraction efficiency of 5th /%
    5322.212.19
    6330.720.76
    7800.040.03
    8520.200.18
    Table 2. Simulation results of asymmetric mark
    Guangying Zhou, Yuejing Qi, Liang Li, Miao Jiang, Jiangliu Shi, Mingyi Yao. Robustness Analysis Method and Simulation Research of Alignment Mark[J]. Acta Optica Sinica, 2023, 43(11): 1113002
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