Study on CTE Mismatch Failure Analysis and Optimization of a Large Size CLCC Device

WANG Yuan; YI Wenshuang; MA Minshu

doi:10.13911/j.cnki.1004-3365.220074

Journals >Microelectronics >Volume 52 >Issue 3 >Page 498 > Article

Microelectronics
Vol. 52, Issue 3, 498 (2022)

Study on CTE Mismatch Failure Analysis and Optimization of a Large Size CLCC Device

WANG Yuan, YI Wenshuang, and MA Minshu

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[in Chinese]

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DOI: 10.13911/j.cnki.1004-3365.220074 Cite this Article

WANG Yuan, YI Wenshuang, MA Minshu. Study on CTE Mismatch Failure Analysis and Optimization of a Large Size CLCC Device[J]. Microelectronics, 2022, 52(3): 498 Copy Citation Text

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References

[1] STEINBERG D S. Cooling techniques for electronic equipment ［M］. New York: John Wiley & Sons, 1991： 45-66.

[10] PAO Y H. A fracture mechanism approach to thermal fatigue life prediction of solder joints ［J］. IEEE Trans Compon Hybrids Manuf Technol, 1992, 15(4): 559-570.

WANG Yuan, YI Wenshuang, MA Minshu. Study on CTE Mismatch Failure Analysis and Optimization of a Large Size CLCC Device[J]. Microelectronics, 2022, 52(3): 498

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