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    Journals >Laser & Optoelectronics Progress >Volume 58 >Issue 21 >Page 2114011 > Article
    • Laser & Optoelectronics Progress
    • Vol. 58, Issue 21, 2114011 (2021)
    VCSEL Array Microsystem Packaging Based on SiP Technology
    Lihao Wang1、2、3, Dengyuan Fu1、2、3, Junyuan Zhao1、2、3, Songqing Zhao4、5, Genshui Wu4、5, Haiyan Chen4、5, Yinfang Zhu1、2、3、*, and Jinling Yang1、2、3、**
    Author Affiliations
  • 1Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
  • 3State Key Laboratory of Transducer Technology, Shanghai 200050, China
  • 4China Airbome Missile Academy, Luoyang , Henan 471009, China
  • 5Aviation Key Laboratory of Science and Technology on Airbome Guided Weapons, Luoyang , Henan 471009, China
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    DOI: 10.3788/LOP202158.2114011 Cite this Article Set citation alerts
    Lihao Wang, Dengyuan Fu, Junyuan Zhao, Songqing Zhao, Genshui Wu, Haiyan Chen, Yinfang Zhu, Jinling Yang. VCSEL Array Microsystem Packaging Based on SiP Technology[J]. Laser & Optoelectronics Progress, 2021, 58(21): 2114011 Copy Citation Text show less
    Structure diagram of system package
    Fig. 1. Structure diagram of system package
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    Operating temperature characteristics of single device. (a) Temperature distribution diagram; (b) radial temperature curve
    Fig. 2. Operating temperature characteristics of single device. (a) Temperature distribution diagram; (b) radial temperature curve
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    Operating temperature characteristics of the device array. (a) Temperature distribution diagram; (b) radial temperature curve
    Fig. 3. Operating temperature characteristics of the device array. (a) Temperature distribution diagram; (b) radial temperature curve
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    Schematic diagram of laser array drive module
    Fig. 4. Schematic diagram of laser array drive module
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    Cross-sectional view of manufacturing process
    Fig. 5. Cross-sectional view of manufacturing process
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    Abstract
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    Figures&Tables (5)
    Equations (2)
    References (18)
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    Lihao Wang, Dengyuan Fu, Junyuan Zhao, Songqing Zhao, Genshui Wu, Haiyan Chen, Yinfang Zhu, Jinling Yang. VCSEL Array Microsystem Packaging Based on SiP Technology[J]. Laser & Optoelectronics Progress, 2021, 58(21): 2114011
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    Paper Information
    Recommended Topics
    laser devices and laser physics
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    laser manufacturing
    Instrumentation, Measurement and Metrology