This paper proposes a microsystem composed of vertical cavity surface-emitting laser arrays, laser driver chips, and power chips based on system in package technology to meet the needs of the hardware-in-the-loop simulation system. In addition, a manufacturing process flow based on microelectromechanical systems technology was developed. The packaging method has a high level of integration and high reliability. Driving efficiency and space utilization are significantly improved compared with other driving and packaging methods. Consequently, it has broad application prospects in optical imaging, communication, and interconnection, laying the groundwork for realizing the laser-imaging generator in semi-physical simulation systems.