Design and Experimental Study of Double-Pattern Nonuniform Coupling Fixed-Abrasive Pads

Chaoqun Xu; Congfu Fang; Zhen Yan

doi:10.3788/AOS202040.0824001

[1] Zhang N C, Wang P, Hua X et al. Optical radiation characteristics and structural phase transition of sapphire under megabar pressure[J]. Acta Optica Sinica, 39, 0730002(2019).

[2] Hu Z W, Shao M J, Guo J M et al. Comparison of grinding characteristics of different crystal surfaces for sapphire[J]. Optics and Precision Engineering, 25, 1250-1258(2017).

[3] Hu X B, Hao Q, Guo Z R et al. Dicing of sapphire wafer with all-fiber picosecond laser[J]. Chinese Journal of Lasers, 44, 0102016(2017).

[4] Gagliardi J J, Kim D, Sokol J J et al. A case for 2-body material removal in prime LED sapphire substrate lapping and polishing[J]. Journal of Manufacturing Processes, 15, 348-354(2013).

[5] Liang Z Q, Wang X B, Wu Y B et al. An investigation on wear mechanism of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire[J]. Journal of Materials Processing Technology, 212, 868-876(2012).

[6] Arunachalam A P S, Idapalapati S, Subbiah S. Multi-criteria decision making techniques for compliant polishing tool selection[J]. The International Journal of Advanced Manufacturing Technology, 79, 519-530(2015).

[7] Tam H Y, Cheng H B[J]. Wang Y W. Removal rate, surface roughness in the lapping, polishing of RB-SiC optical components. Journal of Materials Processing Technology, 192/193, 276-280(2007).

[8] Li M. Pattern optimization of polished abrasive pad and performance evaluation of polishing pad[D]. Nanjing: Nanjing University of Aeronautics and Astronautics(2010).

[9] Zhu Y W, Wang J, Li J et al. Research on the polishing of silicon wafer by fixed abrasive pad[J]. China Mechanical Engineering, 20, 723-727, 732(2009).

[10] Yu J F. Studies on properties and application of novel CMP pad and slurry[D]. Guangzhou: South China University of Technology(2010).

[11] Du J X, Su J X, Wang Z H et al. Formation mechanism of non-uniformity on material removal in chemical mechanical polishing of hard and brittle crystal substrate[J]. Journal of Synthetic Crystals, 41, 1130-1137(2012).

[12] Wang Y C, Yang T S. Modeling and calculation of slurry-chemistry effects on chemical-mechanical planarization with a grooved pad[J]. Journal of Engineering Mathematics, 63, 33-50(2009).

[13] Dong Z C, Cheng H B. Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets[J]. International Journal of Machine Tools and Manufacture, 85, 1-13(2014).

[14] Fang C F, Liu C, Zhao Z X et al. Study on geometrical patterns of textured fixed-abrasive pads in sapphire lapping based on trajectory analysis[J]. Precision Engineering, 53, 169-178(2018).

[15] Qiu J, Chen Z X, Wei S J et al. Design of orderly arraying diamond grits and its trajectory simulation based on PRO/E[J]. Superhard Material Engineering, 24, 21-24(2012).

[16] Deng W W. Preparation and experimental study of brazed micro-powder diamond grinding disc with surface grooved abrasive block[D]. Xiamen: Huaqiao University(2017).