• Infrared and Laser Engineering
  • Vol. 51, Issue 3, 20210133 (2022)
Jiangfeng Zhang1, Xiaohan Tian1, Xiaoling Zhang2, and Qingduan Meng1
Author Affiliations
  • 1School of Electrical Engineering, Henan University of Science and Technology, Luoyang 471023, China
  • 2School of Software, Henan University of Science and Technology, Luoyang 471023, China
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    DOI: 10.3788/IRLA20210133 Cite this Article
    Jiangfeng Zhang, Xiaohan Tian, Xiaoling Zhang, Qingduan Meng. Research on local delamination failure mechanism of InSb infrared focal plane arrays detector[J]. Infrared and Laser Engineering, 2022, 51(3): 20210133 Copy Citation Text show less
    References

    [1] H S Mou. Status and progress of InSb IRFPA detector. Laser & Infrared, 46, 394-399(2016).

    [2] R K Bhan, V Dhar. Recent infrared detector technologies, applications, trends and development of HgCdTe based cooled infrared focal plane arrays and their characterization. Opto-Electronics Review, 27, 174-193(2019).

    [3] P Klipstein, D Aronov, M B Ezra, et al. Recent progress in InSb based quantum detectors in Israel. Infrared Physics & Technology, 59, 172-181(2013).

    [4] W Bai. Development status of InSb infrared focal plane array detectors. Infrared, 40, 1-14(2019).

    [5] L Gui, Q D Meng, L W Zhang, et al. Failure analysis of InSb infrared detector based on CZM. Laser & Infrared, 43, 1368-1371(2013).

    [6] Q D Meng, Y Q Lv, Z X Lu, et al. Stress in InSb infrared focal plane array detector analyzed with ANSYS. Journal of Infrared and Millimeter Waves, 29, 431-434(2010).

    [7] Q D Meng, X L Zhang, Y Q Lv, et al. Local delamination of InSb IRFPAs in liquid nitrogen shock tests. Infrared Physics and Technology, 86, 207-211(2017).

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    [11] W Guo, P J Chen, L Y Yu, et al. Numerical analysis of the strength and interfacial behavior of adhesively bonded joints with varying bondline thicknesses. International Journal of Adhesion and Adhesives, 98, 102553(2020).

    [12] M A Bellali, M Mokhtari, H Benzaama, et al. Using CZM and XFEM to predict the damage to aluminum notched plates reinforced with a composite patch. Journal of Mechanics of Materials and Structures, 15, 185-201(2020).

    [13] K M Chen, D S Jiang, N H Kao, et al. Effects of underfill materials on the reliability of low-K flip-chip packaging. Microelectronics Reliability, 46, 155-163(2006).

    [14] X L Zhang, Q D Meng, Y Q Lv, et al. Assessment of InSb infrared detector arrays assembly procedure employing ANSYS. Optical and Quantum Electronics, 51, 1-8(2019).

    [15] L W Zhang, Q D Meng, X L Zhang, et al. Modeling and stress analysis of large format InSb focal plane arrays detector under thermal shock. Infrared Physics & Technology, 60, 29-34(2013).

    [16] P P Camanho, C G Davila, Moura M F De. Numerical simulation of mixed-mode progressive delamination in composite materials. Journal of Composite Materials, 37, 1415-1438(2003).

    [17] Y Y Xiao, W K Shi, Z H Han, et al. Residual stress and its effect on failure in a DLC coating on a steel substrate with rough surfaces. Diamond & Related Materials, 66, 23-35(2016).

    Jiangfeng Zhang, Xiaohan Tian, Xiaoling Zhang, Qingduan Meng. Research on local delamination failure mechanism of InSb infrared focal plane arrays detector[J]. Infrared and Laser Engineering, 2022, 51(3): 20210133
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