[1] J Li, X K Wang, W Sun, et al. Study on Dewar package for dual-band long linear IRFPA detectors. Infrared and Laser Engineering, 47, 1104003(2018).
[2] L Zhang, H J Dong, C S Wang, et al. Design of cold head in mosaic infrared detector. Laser & Infrared, 47, 591-594(2017).
[3] X L Li, L Zhang, Z K Fu. Analysis on finite element method of thermal stress for infrared focal plane detector. Laser & Infrared, 50, 429-434(2020).
[4] W Xia, X K Wang, C Lin, et al. Dewar for 12.5 μm long linear HgCdTe IRFPA. Laser & Infrared, 42, 389-392(2012).
[5] X N Hu, H Y Zhang, Y J Li, et al. Thermal stress analysis of HgCdTe focal plane arrays on Si substrates. Laser & Infrared, 36, 1020-1022(2006).
[6] G Y Fan, H M Gong, Y J Li, et al. Temperature-cycling reliability of IRFPA device. Infrared and Laser Engineering, 39, 607-610(2010).
[7] X Chen, H Hua, K He, a1 et. Thermal stress analysis of IRFPA packaging assembly. Laser & Infrared, 44, 645-648(2014).
[8] C X Xia, W Sun, X K Wang. Test study of strain after integration of large scale infrared detector chip into cryogenic cold platformat at low temperature. Infrared, 38, 23-26(2017).
[9] X Chen, K He, J X Wang, et al. Thermal cycling reliability of linear HgCdTe infrared detectors. J Infrared Millim Waves, 33, 369-374(2014).
[10] H Xie, H J Dong, Y Zhang. Research on butting technology of long wave infrared linear HgCdTe FPA. Laser & Infrared, 47, 58-61(2017).