Author Affiliations
1Ningbo Institute, Research & Development Institute in Shenzhen, School of Mechanical and Engineering, Northwestern Polytechnical University, Xi′an, Shaanxi 710072, China;2Key Laboratory of Micro/Nano Systems for Aerospace (Ministry of Education), Key Laboratory of Micro and Nano Electro-Mechanical Systems of Shaanxi Province, Northwestern Polytechnical University, Xi′an, Shaanxi 710072, China3Xian Modern Control Technology Research Institute, Xi′an, Shaanxi 710065, China4School of Information and Electronics, Beijing Institute of Technology, Beijing 100081, Chinashow less
Fig. 1. Basic structure and working principle of MEMS-FP filtering chips
Fig. 2. Comparison of MEMS-FP filtering chips based on bulk micromachining and surface micromachining. (a) Bulk micromachining; (b) surface micromachining
Fig. 3. MEMS-FP filtering chips based on different actuation strategies. (a) Electrostatic actuation
[45]; (b) piezoelectric actuation
[52]; (c) thermal actuation
[53]; (d) electromagnetic actuation
[54] Fig. 4. Reflectance of different metallic films with different thicknesses. (a) Au film; (b) Ag film; (c) Al film
Fig. 5. Reflectance of DBR with different film compositions. (a) Schematic structure; (b) TiO2/SiO2 film; (c) TiO2/Al2O3 film
Fig. 6. Phase shift of MEMS-FP filtering chip based on DBR
Fig. 7. Photonic-crystal reflector based on sub-wavelength periodic hole-array
[60]. (a) Schematic structure; (b) SEM picture; (c) measured reflectance
Fig. 8. Electrostatically tunable MEMS-FP filtering chip working in mid-infrared wavelength developed by NASA in US
[62] Fig. 9. Electrostatically tunable MEMS-FP filtering chip working in visible wavelength and spectral imaging system developed by US Army Research Laboratory
[64-66] Fig. 10. Infrared MEMS-FP filtering chip and tunable pyroelectric detector
[68]. (a) Schematic structure; (b) optical performance; (c) tunable pyroelectric detector
Fig. 11. Dual-band MEMS-FP filtering chip and detector module
[43,70-72]. (a) Schematic structure and spectral performance of filtering chip; (b) optical design and assemble process of detector module
Fig. 12. Visible light MEMS-FP filtering chip based on Si
3N
4 film
[73]. (a) Schematic structure and working principle; (b) filtering chips with different aperture size; (c) optical performance
Fig. 13. MEMS-FP filtering chip based on photonic-crystal reflector
[75] Fig. 14. Surface-machined MEMS-FP filtering chip working in visible light
[78] Fig. 15. Surface-machined MEMS-FP filtering chip based on Ag mirror
[83] Fig. 16. Piezo-actuated MEMS-FP filtering chip series developed by VTT
[77] Fig. 17. Spectral imager used for UAV
[84-86] Fig. 18. Spectral sensor for mobile gas detection
[87] Fig. 19. Spectral imaging module assembled with iPhone 5s
[88] Fig. 20. Aalto-1 cube nanosatellite and its miniaturized spectral imager payload (AaSI)
[92-93] Fig. 21. Hand-held spectral detection systems based on MEMS-FP filtering chips
[81]. (a) Hand-held spectral imager
[94]; (b) miniaturized spectral imager
[95]; (c) point source type miniaturized spectrometer
Fig. 22. MEMS-FP filtering chips developed by domestic different research institutes. (a)(b) Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
[96-97]; (c)(d) Huazhong University of Science and Technology
[98-99] Fig. 23. Electromagnetic actuation MEMS-FP filtering chips and miniature spectral imagers applied to different wavebands developed by Northwestern Polytechnical University. (a) Visible light waveband;(b) long-wave infrared waveband
Fig. 24. Common optical materials and their properties. (a) Transmission range; (b) transmittance of typical infrared optical materials
Fig. 25. MEMS-FP filtering structures based on GST phase-change material. (a) FP tunable filtering structure
[104]; (b) metasurface filtering structure
[105] Characteristic | Bulk micromachining | Surface micromachining |
---|
Number of substrates | No less than two | Normally one | Flexibility of design | High | Low | Complexity of fabrication | High | High | Sensitivity to external force | High | Low | Chip size (aperture size) | Large | Small |
|
Table 1. Comparison of MEMS-FP filtering chips based on bulk micromachining and surface micromachining
Actuation strategy | Advantage | Disadvantage |
---|
Electrostatic actuation | High design flexibility, simple structure,rapid response, high process compatibility | Non-linear response, pull-in phenomenon,limited tuning range (1/3 of FP cavity length) | Piezoelectric actuation | Large aperture (up to 19 mm) | Low fabrication efficiency, high actuating voltage | Thermal actuation | Large tuning range | Slow response, high power consumption | Electromagnetic actuation | Large tuning range (up to 5 μm),linear response (linearity better than 80%) | Thermal drift |
|
Table 2. Performance comparison of MEMS-FP filtering chips based on different actuation strategies
Mirror type | Advantage | Disadvantage |
---|
Metallic mirror | Thin film thickness, wide band range,simple fabrication process | High absorption loss,oxidization/sulfurization phenomenon | DBR | High customization capability, low absorption loss,high spectral resolution | Limited band range, high film stress,phase-shift phenomenon |
|
Table 3. Characteristic comparison of metallic mirror and DBR