• Chinese Optics Letters
  • Vol. 20, Issue 3, 032201 (2022)
Shuai Wan1、2, Rui Niu1、2, Jin-Lan Peng3, Jin Li1、2, Guang-Can Guo1、2, Chang-Ling Zou1、2, and Chun-Hua Dong1、2、*
Author Affiliations
  • 1CAS Key Laboratory of Quantum Information, University of Science and Technology of China, Hefei 230026, China
  • 2CAS Center For Excellence in Quantum Information and Quantum Physics, University of Science and Technology of China, Hefei 230026, China
  • 3Center for Micro and Nanoscale Research and Fabrication, University of Science and Technology of China, Chinese Academy of Sciences, Hefei 230026, China
  • show less
    DOI: 10.3788/COL202220.032201 Cite this Article Set citation alerts
    Shuai Wan, Rui Niu, Jin-Lan Peng, Jin Li, Guang-Can Guo, Chang-Ling Zou, Chun-Hua Dong. Fabrication of the high-Q Si3N4 microresonators for soliton microcombs[J]. Chinese Optics Letters, 2022, 20(3): 032201 Copy Citation Text show less

    Abstract

    The microresonator-based soliton microcomb has shown a promising future in many applications. In this work, we report the fabrication of high quality (Q) Si3N4 microring resonators for soliton microcomb generation. By developing the fabrication process with crack isolation trenches and annealing, we can deposit thick stoichiometric Si3N4 film of 800 nm without cracks in the central area. The highest intrinsic Q of the Si3N4 microring obtained in our experiments is about 6×106, corresponding to a propagation loss as low as 0.058 dBm/cm. With such a high Q film, we fabricate microrings with the anomalous dispersion and demonstrate the generation of soliton microcombs with 100 mW on-chip pump power, with an optical parametric oscillation threshold of only 13.4 mW. Our Si3N4 integrated chip provides an ideal platform for researches and applications of nonlinear photonics and integrated photonics.
    Shuai Wan, Rui Niu, Jin-Lan Peng, Jin Li, Guang-Can Guo, Chang-Ling Zou, Chun-Hua Dong. Fabrication of the high-Q Si3N4 microresonators for soliton microcombs[J]. Chinese Optics Letters, 2022, 20(3): 032201
    Download Citation