[1] Wang Qing. Study on aluminum core printed circuit board applying in high power LED packaging[D]. Hangzhou: Zhejiang University(2011).

[2] Tian Minbo[M]. Electronic packaging technology(2003).

[3] Fu X Y, Liu X J, Wu Y. Research and analysis of the design development and perspective technology for LED lighting products[C]. IEEE, International Conference on Computer-Aided Industrial Design & Conceptual Design, 1330-1334(2009).

[4] Liang Wenyue, Li Yuanxing, Long Yongbing et al. Design of freeform surface lens with chip on board LED sources for uniform illumination[J]. Laser & Optoelectronics Progress, 54, 012202(2017).

[5] Pimputkar S, Speck J S, Denbaars S P et al. Prospects for LED lighting[J]. Nature Photonics, 3, 180-182(2009).

[6] Fang Jun, Hua Gang, Fu Renli et al. Structure and substrate for high power white LED package[J]. Semiconductor Technology, 38, 67-74(2013).

[7] Sun Haojie, Li Baicheng, Zhang Dawei et al. Parameters analysis of a new type of white-light LED package structure[J]. Acta Optica Sinica, 29, 356-358(2009).

[8] Liu Chao, Fu Renli, Gu Xiguang et al. Structure of chip scale package for LED light source and its thermal performance analysis based on numerical simulation[J]. Laser & Optoelectronics Progress, 53, 122301(2016).

[9] Wu Chaohui, Cheng Hao, Zhang Jun et al. Technologies and development status of heat spreader for high-power LED packaging[J], 37, 1-6(2016).

[10] Qian Fei, Fu Renli, Zhang Pengfei et al. Influence of ceramic substrate and soldering join technology on thermal dissipation performance of LED[J]. Electronic Components & Materials, 33, 47-51(2014).

[11] Kim S H, Singh S, Oh S K et al. Visible flip-chip light-emitting diodes on flexible ceramic substrate with improved thermal management[J]. IEEE Electron Device Letters, 37, 615-517(2016). http://ieeexplore.ieee.org/document/7442828/

[12] Ouyang Xueqiong, Wang Shuangxi, Zheng Qiongna et al. Development of package substrates for high power LED[J]. Electronics and Packaging, 11, 1-5(2011).

[13] He H, Fu R L, Wang D L et al. A new method for preparation of direct bonding copper substrate on Al2O3[J]. Materials Letters, 61, 4131-4133(2007). http://www.sciencedirect.com/science/article/pii/S0167577X07000675

[14] Zhang P F, Fang J, Fu R L et al. Bonding of Al to Al2O3, via Al-Cu eutectic method[J]. Materials & Design, 87, 619-624(2015). http://www.sciencedirect.com/science/article/pii/S0264127515303142

[15] Zhang P F, Fu R L, Tang Y et al. Morphology of thick film metallization on aluminum nitride ceramics and composition of interface layer[J]. Ceramics International, 41, 13381-13388(2015). http://www.sciencedirect.com/science/article/pii/S0272884215014157