Material Removal Characteristics of Polishing Pad with Small-Tool Correction

Sun Rongkang; Wang Jindong; Cheng Cong; Liao Defeng

doi:10.3788/CJL202047.0403001

[1] Cheng H B, Feng Z J, Cheng K et al. Design of a six-axis high precision machine tool and its application in machining aspherical optical mirrors[J]. International Journal of Machine Tools and Manufacture, 45, 1085-1094(2005).

[2] Davis J A, Cottrell D M, Lilly R A et al. Multiplexed phase-encoded lenses written on spatial light modulators[J]. Optics Letters, 14, 420-422(1989).

[3] Chen J. Research on real-time surface monitoring of polishing pad in continuous polishing[D]. Beijing: University of Chinese Academy of Sciences(2015).

[4] polishing machines: US8123593[P/OL]. -02-28[2019-09-15]. https:∥patents.glgoo.top/patent/US8123593B2/en.(2012).

[5] Wang Z, Xu X K, Shao J D et al. Flatness measurement of pitch lap for large continuous polisher[J]. Optics and Precision Engineering, 24, 3048-3053(2016).

[6] Vasilev B, Bott S, Rzehak R et al. A method for characterizing the pad surface texture and modeling its impact on the planarization in CMP[J]. Microelectronic Engineering, 104, 48-57(2013).

[7] Nguyen N Y, Zhong Z W, Tian Y B. Analysis and improvement of the pad wear profile in fixed abrasive polishing[J]. The International Journal of Advanced Manufacturing Technology, 85, 1159-1165(2016).

[8] Chang O, Kim H, Park K et al. Mathematical modeling of CMP conditioning process[J]. Microelectronic Engineering, 84, 577-583(2007).

[9] Shan H Y, Xu X K, He H B et al. The figure simulation of the polishing pad in the continuous polishing process[J]. Proceedings of SPIE, 9238, 92380G(2014).

[10] Yin J, Zhu J Q, Jiao X et al. Method of steady-state deterministic polishing based on continuous polishing[J]. Chinese Journal of Lasers, 44, 1102001(2017).

[11] Cao C, Feng G Y, Yang L M et al. Calculation and simulation for the factors affecting relative grinding removal in ultra-precision continuous polishing[J]. Opto-Electronic Engineering, 31, 67-71(2004).

[12] Zhang J, Dai L, Wang F et al. Restraint of mid-spatial-frequency error aspheric surface by small-tool adaptive polishing[J]. Acta Optica Sinica, 33, 0822002(2013).

[13] Dai Y F, Shang W J, Zhou X S. Effection of the material of a small tool to the removal function in computer control optical polishing[J]. Journal of National University of Defense Technology, 28, 97-101(2006).

[14] Lee H, Lee S. Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal[J]. Precision Engineering, 49, 85-91(2017).

[15] Liao D, Zhang Q, Xie R et al. Deterministic measurement and correction of the pad shape in full-aperture polishing processes[J]. Journal of the European Optical Society: Rapid Publications, 10, 15049(2015).

[16] Liao D F, Zhang Q H, Zhao S J et al. -12-10[P]. device of surface shape of polishing pad in full-aperture polishing: 201410456502.5.(2014).

[17] Liao D F, Xie R Q, Sun R K et al. Improvement of the surface shape error of the pitch lap to a deterministic continuous polishing process[J]. Journal of Manufacturing Processes, 36, 565-570(2018).

[18] Preston F W. The structure of abraded glass surfaces[J]. Transactions of the Optical Society, 23, 141-164(1922).