Sun Rongkang, Wang Jindong, Cheng Cong, Liao Defeng. Material Removal Characteristics of Polishing Pad with Small-Tool Correction[J]. Chinese Journal of Lasers, 2020, 47(4): 403001
- Chinese Journal of Lasers
- Vol. 47, Issue 4, 403001 (2020)
Fig. 1. Schematic of continuous polishing
Fig. 2. Distribution of sampling points on polishing pad surface. (a) Spiral distribution; (b) circle distribution; (c) radial linear distribution
Fig. 3. Straightness detection of guide
Fig. 4. Test results of straightness of guide
Fig. 5. Schematic for tilt detection of rotating axis of polishing pad
Fig. 6. Schematic of polishing pad surface shape detection
Fig. 7. Three detected actual surface shapes of polishing pad under the same conditions
Fig. 8. Structure sketch of small-tool
Fig. 9. Relative motion analysis of small-tool
Fig. 10. Simulation result of small-tool correction
Fig. 11. Radial profile comparison of polishing pad before and after correction
Fig. 12. Comparison between theoretical and experimental results
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Table 1. Detection results of inclination of pad rotation axis10-3 mm·m-1
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