Yingying Yan, Zhiwen Chen, Jian Qiu, Kefu Liu, Jianwei Zhang. Effect of Package on Luminescence Characteristics of High-Power VCSEL with Narrow Pulse[J]. Acta Optica Sinica, 2020, 40(8): 0814001
- Acta Optica Sinica
- Vol. 40, Issue 8, 0814001 (2020)
Fig. 1. Cross-sectional diagram of VCSEL array
Fig. 2. Photograph of VCSEL with bare chip
Fig. 3. Photograph of VCSEL with TO package. (a) Side view; (b) top view
Fig. 4. VCSEL with TO package. (a) Diagram of configuration; (b) equivalent circuit
Fig. 5. Simplified diagram of drive circuit
Fig. 6. Simplified diagram of PCB. (a) Top view; (b) bottom view; (c) side view
Fig. 7. Voltage and current simulation waveforms at both ends of VCSEL with different Ls (C=10 nF, V=90 V)
Fig. 8. Voltage and current simulation waveforms at both ends of VCSEL with different Rs (C=10 nF, V=90 V)
Fig. 9. Pulse waveforms of voltage and current at both ends of VCSEL (C=10 nF, V=90 V). (a) VCSEL with TO package; (b) VCSEL with bare chip
Fig. 10. Optical pulse waveforms of VCSEL with TO package and VCSEL with bare chip (C=10 nF, V=90 V)
Fig. 11. Relationship between peak current and peak voltage for VCSEL with TO package and VCSEL with bare chip
Fig. 12. Comparison of simulated and experimental waveform. (a) VCSEL with TO package; (b) VCSEL with bare chip
Fig. 13. Relationship between peak power of optical pulse and peak current of VCSEL with TO package and VCSEL with bare chip (C=10 nF, V=30--90 V)
Fig. 14. Relationship between power conversion efficiency and peak current of VCSEL with TO package and VCSEL with bare chip (C=10 nF, V=30--90 V)
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