• Laser & Optoelectronics Progress
  • Vol. 55, Issue 7, 71405 (2018)
Ge Maozhong1、*, Xiang Jianyun2, and Tang Yang1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/lop55.071405 Cite this Article Set citation alerts
    Ge Maozhong, Xiang Jianyun, Tang Yang. Effect of Laser Shock Processing on Fatigue Crack Growth Rate of TC4 Repaired Parts[J]. Laser & Optoelectronics Progress, 2018, 55(7): 71405 Copy Citation Text show less

    Abstract

    By the fatigue crack growth experiment, the effect of laser shock processing (LSP) on fatigue crack growth rate of TC4 repaired parts is investigated and the changes of surface residual stress, surface roughness and fracture morphology of TC4 repaired parts before and after LSP are compared and analyzed. The experimental results indicate that, the laser repaired zone of TC4 repaired parts is composed of β grains and α phase which distributes along the grain boundaries, and the heat affected zone consists of equiaxed α grains and β transformation structure. After the LSP, the full width at half maximum of diffraction peaks is larger, the surface residual stress is compressive stress, and the surface roughness increases. Based on the modified seven-point incremental polynomial fitting method, the fatigue crack growth rate equations of different repaired parts are obtained. The fatigue crack growth rate of TC4 repaired parts with LSP is smaller than that without LSP.
    Ge Maozhong, Xiang Jianyun, Tang Yang. Effect of Laser Shock Processing on Fatigue Crack Growth Rate of TC4 Repaired Parts[J]. Laser & Optoelectronics Progress, 2018, 55(7): 71405
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