• Infrared and Laser Engineering
  • Vol. 45, Issue 9, 904003 (2016)
Zhai Yongcheng1、2、* and Ding Ruijun1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/irla201645.0904003 Cite this Article
    Zhai Yongcheng, Ding Ruijun. 320×256 LW IRFPA ROIC with large charge capacity[J]. Infrared and Laser Engineering, 2016, 45(9): 904003 Copy Citation Text show less
    References

    [1] Liu Liping. Status and trend of the readout circuit technology for IRFPA[J]. Laser & Infrared, 2007, 37(7): 598-600. (in Chinese)

    [2] Donald A Reago, Stuart Horn, James Campbell, et al. Third generation imaging sensor system concepts[C]//SPIE, Infrared Imaging Systems: Design, Analysis, Modeling and Testing X, 1999, 3701:108-117.

    [3] Paul Norton, James Campbell, Stuart Horn, et al. Third-generation infrared imagers[C]//SPIE, 2000, 4130: 226-236.

    [4] He Li, Yang Dingjiang, Ni Guoqiang, et al. Introduction to Advanced Focal Plane Arrays[M]. Beijing: National Defense Industry Press, 2011. (in Chinese)

    [5] Bai Piji, Yao Libin. Readout integrated circuit for third-generation infrared focal plane detector[J]. Infrared Technology, 2015, 37(2): 89-96. (in Chinese)

    [6] Zhou Jie. 320×256 MW/LW dual-color IRFPAs readout circuits[J]. Infrared and Laser Engineering, 2015, 44(10): 2880-2885. (in Chinese)

    [7] Liao Jun. Design of front-end readout circuit for cryogenic infrared focal plane array[D]. Tianjin: Tianjin University, 2012. (in Chinese)

    [8] Behzad Razavi. Design of Analog CMOS Integrated Circuits[M]. Xi′an: Xi′an Jiaotong University Press, 2002.

    [9] Wang Pan. CTIA input stage design of short-wavelength staring IRFPAs ROIC[J]. Laser & Infrared, 2013, 43(12): 1363-1367. (in Chinese)

    Zhai Yongcheng, Ding Ruijun. 320×256 LW IRFPA ROIC with large charge capacity[J]. Infrared and Laser Engineering, 2016, 45(9): 904003
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